Patents Assigned to Soshotech Co., Ltd.
  • Patent number: 6590406
    Abstract: An apparatus for inspecting a display board or a circuit board in which an inspection terminal 4 of an inspection probe block B is pressed into contact with an electrode pad 3 of a display board or a circuit portion P for inspection. A probe block supporting frame member 2 has an expandable and contractible structure, and when the probe block supporting frame member 2 is expanded, a board supporting frame member 1 can be relatively advanced. Due to the relative advancement of the board supporting frame member 1, the display board or the circuit board P protrudes forward of a distal end of the terminal 4 of the probe block B through an enlarged opening area 16 of the probe supporting frame member 2, so that the display board or the circuit board P supported on the board supporting frame member 1 can be exchanged with another board.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: July 8, 2003
    Assignees: Soshotech Co., Ltd, Adtec Engineering Co., Ltd.
    Inventors: Toshio Okuno, Gunji Mizutani, Masatomo Nagashima, Tadashi Furumi
  • Patent number: 6577145
    Abstract: A unit has inspection block blocks mounted thereon in parallel, wherein a plurality of inspection probe blocks are inserted into and removed from a guide rail through a slider so that the probe blocks can be loaded or replaced. Each probe block is slidingly moved along the guide rail so that its positional adjustment can be made in an extension length of the guide rail. Only one kind of support base can commonly be used by inserting and removing different probe blocks with respect to the support base and the positional adjustment can be done. The unit with inspection probe blocks mounted thereon in parallel includes a support base and a plurality of inspection probe blocks each having a plurality of blocks and arranged on the support base in parallel.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: June 10, 2003
    Assignees: Soshotech Co., Ltd., Adtec Engineering Co., Ltd.
    Inventors: Toshio Okuno, Masatomo Nagashima, Atsushi Oguma, Tadashi Furumi
  • Patent number: 6556004
    Abstract: A supporting framework for a display panel or a probe block is capable of properly coping with display panels of different sizes in a testing apparatus. By moving a framework 1 with a display panel supported thereon or by moving frame members 2, 3, 4, 5 of the framework 1 with a probe block supported thereon, an opening (or space) defined by the respective frame members can be enlarged or reduced.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: April 29, 2003
    Assignees: Soshotech Co., Ltd., Adtec Engineering Co., Ltd.
    Inventors: Toshio Okuno, Gunji Mizutani, Masatomo Nagashima
  • Patent number: 6450469
    Abstract: A rectangular support framework for a flat panel display as an object to be tested or a testing probe block is disclosed.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: September 17, 2002
    Assignees: Soshotech Co., Ltd, Adtec Engineering Co., Ltd.
    Inventor: Toshio Okuno
  • Patent number: 6398561
    Abstract: A contact structure of a lead in which a contact structure having a lead and a bump made of suitable metals, respectively, can be formed easily and the bump and the lead can be soundly connected together in terms of electricity and strength. The contact structure of the lead comprises a lead 12 formed by etching a conductive foil 11, and a bump 5 formed by electric casting by means of plating. The bump 5 and the lead 12 are formed of different metals, respectively, and the bump 5 is connected to a surface of the lead 12 through a conductive connecting material 10. The lead 12 is intimately contacted at a surface, on which the bump 5 is disposed, with a first main surface 15 of a holeless insulative sheet 8. A basal portion of the bump 5 is forcibly pierced into and extended all the way through the thickness of a material of the holeless insulative sheet 8 and a side surface of the basal portion of the bump 5 is fusion-adhered to an inner wall surface of the through-hole 17.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: June 4, 2002
    Assignees: Soshotech Co., Ltd., Yamaichi Electronics Co., Ltd.
    Inventors: Toshio Okuno, Etsuji Suzuki
  • Patent number: 6211691
    Abstract: A probe unit having a plurality of elongate leads disposed longitudinally in an array on a surface of an insulative sheet. Tip portions of the leads aligned along an end edge of the sheet are capable of being brought into contact, under pressure, with corresponding electrode pads of an electronic part. An insulative material is embedded in at least those areas of grooves between the tip portions of the leads. Slots, which are smaller in width than the leads, are formed between the tip portions of the leads. The tip portions of the leads have a reduced width and are longitudinally disposed on wide comb tooth like pieces of the insulative sheet isolated by the slots, and the insulative materials isolated by the slots are longitudinally intimately disposed along the opposite ends of the tip portions of the leads.
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: April 3, 2001
    Assignee: Soshotech Co., Ltd.
    Inventor: Toshio Okuno
  • Patent number: 6181150
    Abstract: A contact probe includes a plurality of leads arranged in array on a surface of an insulating film in an intimately contacted manner. A distal end portion of each of the leads is contacted, under pressure, with an electronic part. Each of the leads is provided with an anchor portion projecting from a mating surface thereof with respect to the insulating film and anchored in the insulating film, and the anchor portion is engaged with the insulating film.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: January 30, 2001
    Assignee: Soshotech Co., Ltd.
    Inventor: Toshio Okuno
  • Patent number: 6111418
    Abstract: In the contact probe 1 having an array of leads 3 densely attached to a surface of an insulative film 2, pressure contact ends are formed by one end of the leads 3 being arranged in an array along one end edge portion of the insulative film 3. Slots are formed in the one end edge portion of the insulative film 2 such that the slots 9 are open between adjacent contact ends. When the lead ends arranged in the array on the surface of the insulative film are contacted under pressure with a given electronic part, a sufficient degree of freedom of flexure of the contact ends is obtained, so that the contact ends are contacted under pressure with the external terminals of the electronic part.
    Type: Grant
    Filed: February 19, 1998
    Date of Patent: August 29, 2000
    Assignee: Soshotech Co., Ltd.
    Inventors: Toshio Okuno, Hiroshi Katakawa, Narutoshi Kobashi, Kenichi Okamoto