Patents Assigned to SP3
  • Diamond probe tip
    Patent number: 5763879
    Abstract: A probe for electrical contact with a metal layer of an integrated circuit wherein the probe features a polycrystalline diamond layer coating a fine conductive wire. The diamond coating has exposed pyramidal facets having a density of at least 2000 per square millimeter. The substrate has a radius exceeding one micrometer.
    Type: Grant
    Filed: September 16, 1996
    Date of Patent: June 9, 1998
    Assignees: Pacific Western Systems, SP3
    Inventors: Jerry W. Zimmer, Daniel A. Worsham