Patents Assigned to Space Electronics, Inc.
  • Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
    Patent number: 6720493
    Abstract: A radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose an integrated circuit die within, wherein the lid and the base are each constructed from a high Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high Z material disposed between the integrated circuit die and the base, in combination with a high Z material lid to substantially block incident radiation.
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: April 13, 2004
    Assignee: Space Electronics, Inc.
    Inventors: David J. Strobel, David R. Czajkowski
  • Radiation shielding of three dimensional multi-chip modules
    Publication number: 20040031618
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 19, 2004
    Applicants: Maxwell Electronic Components Group, Inc., Space Electronics, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Radiation shielding of plastic integrated circuits
    Patent number: 5889316
    Abstract: A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.
    Type: Grant
    Filed: February 1, 1996
    Date of Patent: March 30, 1999
    Assignee: Space Electronics, Inc.
    Inventors: David J. Strobel, David R. Czajkowski
  • Radiation shielding of three dimensional multi-chip modules
    Patent number: 5880403
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: March 9, 1999
    Assignee: Space Electronics, Inc.
    Inventors: David Czajkowski, Neil Eggleston, Janet Patterson
  • Radiation shielding of plastic integrated circuits
    Patent number: 5825042
    Abstract: A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: October 20, 1998
    Assignee: Space Electronics, Inc.
    Inventors: David J. Strobel, David R. Czajkowski
  • Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
    Patent number: 5635754
    Abstract: The radiation shielded and packaged integrated circuit semiconductor device includes a lid secured to a base to enclose the integrated circuit die within, wherein the lid and the base are each constructed from a high-Z material to prevent radiation from penetrating therethrough. Another embodiment includes a die attach slug constructed from a high-Z material disposed between the integrated circuit die and a base, in combination with a high-Z material lid to substantially block incident radiation.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: June 3, 1997
    Assignee: Space Electronics, Inc.
    Inventors: David J. Strobel, David R. Czajkowski