Abstract: A method includes minimizing current leaking through a virtual ground pipe during access of NROM memory cells. The minimizing includes operating two neighboring memory cells generally together, which includes connecting an operation voltage to a shared local bit line of the two neighboring memory cells and connecting the external local bit lines of two neighboring memory cells to a receiving unit, such as a ground supply or two sense amplifiers. Also included is an array performing the method.

Abstract: The pipe effect can significantly degrade flash performance. A method to significantly reduce pipe current and (or neighbor current using a pre-charge sequence) is disclosed. A dedicated read order keeps the sensing node facing the section of the pipe which was pre-charged. The technique involves pre-charging several global bitlines (such as metal bitlines, or MBLs) and local bitlines (such as diffusion bitlines, or DBLs). The pre-charged global bitlines are selected according to a pre-defined table per each address. The selection of the global bitlines is done according to whether these global bitlines will interfere with the pipe during the next read cycle.

Abstract: A memory chip includes a memory array and a two-dimensional sensing system. The array includes a multiplicity of memory cells connected in rows by word lines and in columns by bit lines. The sensing system moves a read point two-dimensionally within a two-dimensional read space as the two-dimensional read space shrinks and shifts over the life of the chip.

Abstract: A method includes minimizing current leaking through a virtual ground pipe during access of NROM memory cells. The minimizing includes operating two neighboring memory cells generally together, which includes connecting an operation voltage to a shared local bit line of the two neighboring memory cells and connecting the external local bit lines of two neighboring memory cells to a receiving unit, such as a ground supply or two sense amplifiers. Also included is an array performing the method.

Abstract: A method includes minimizing current leaking through a virtual ground pipe during access of NROM memory cells. The minimizing includes operating two neighboring memory cells generally together, which includes connecting an operation voltage to a shared local bit line of the two neighboring memory cells and connecting the external local bit lines of two neighboring memory cells to a receiving unit, such as a ground supply or two sense amplifiers. Also included is an array performing the method.

Abstract: Disclosed are methods, circuits, devices and systems for operating one or more non-volatile memory (NVM) cells within an array of NVM cells. According to embodiments, there may be provided a nonvolatile memory (NVM) device comprising an array of NVM data cells including one or more border/periphery data cells and one or more non-periphery cells. Array control circuitry may be adapted to gauge a state of the one or more periphery data cells differently than non-periphery data cells.

Abstract: A Flash memory array comprises a plurality of Erase Sectors (Esecs) arranged in a plurality of Erase Sector Groups (ESGs), Physical Pages (slices), and Physical Sectors (PSecs), and there is a non-binary number of at least one of the Erase Sector Groups (ESGs), Physical Pages (slices), and Physical Sectors (PSecs). A user address is translated into a physical address using modular arithmetic to determine pointers (ysel, esg, psec) for specifying a given Erase Sector (ESec) within a given Erase Sector Group (ESG); a given Erase Sector Group (ESG) within a given Physical Sector (Psec); and a given Physical Sector (PSec) within the array.

Abstract: A load adjustment circuit and a method for adjusting a load are provided. The circuit may include a power source to supply power to a load, and a control unit to control a property of the load. The control unit may be adapted to adjust a property of the load based on a signal received from the power source. The method may include supplying power to a load and adjusting a property of the load to decrease the power supplied to the load if the power supplied to the load is greater than a maximum threshold.

Abstract: The present invention includes methods, circuits and systems for reading non-volatile memory (“NVM”) cells, including multi-level NVM cells. According to some embodiments of the present invention, there may be provided a NVM cell threshold voltage detection circuit adapted to detect an approximate threshold voltage associated with a charge storage region of a NVM cell, where the NVM cell may be a single or a multi-charge storage region cell. A decoder circuit may be adapted to decode and/or indicate the logical state of a NVM cell charge storage region by mapping or converting a detected approximate threshold voltage of the charge storage region into a logical state value.

Abstract: The present invention is a circuit and method for providing a reference voltage and/or one or more circuit/circuit-block enabling signals for an IC. As the voltage level on a power supply line ramps upward towards or above a nominal operating voltage, a first threshold voltage detector circuit segment may be activated and may begin to generate a bandgap reset signal once the voltage level of the power supply reaches a first threshold voltage level. The bandgap reset signal may trigger the power-up and operation of a bandgap reference circuit segment, and according to further embodiments of the present invention, a second threshold voltage detector circuit segment, which second threshold voltage detector circuit segment may be matched with the first voltage detector circuit, may generate a voltage reset signal indicating that the bandgap reference source is powering-up. Once the supply voltage reaches a third threshold reference voltage, the first detector may disable the bandgap reset.

Abstract: In a nonvolatile memory (NVM) cell, an injector having one or more layers of material with a lower potential barrier for holes is disposed between a charge storage stack and a source of holes (the gate for top injection, the substrate for bottom injection), to facilitate hole tunneling from the source of holes into the charge-storage layer of the charge storage stack. The injector has a barrier potential for holes which is less than an insulating layer of the charge-storage stack which is oriented towards the source of holes. A multi-layer crested barrier injector may have layers of increasing potential barriers for holes from the source to the charge-storage layer. Methods of operating NVM cells are disclosed. The NVM cell may be NROM, SONOS, or other oxide-nitride technology NVM cells such as SANOS, MANOS, TANOS.

Abstract: Retention of charges in a nonvolatile memory (NVM) cell having a nitride-based injector (such as SiN, SIRN, SiON) for facilitating injection of holes into a charge-storage layer (for NROM, nitride) of a charge-storage stack (for NROM, ONO) may be improved by providing an insulating layer (for NROM, oxide) between the charge-storage layer and the injector has a thickness of at least 3 nm. Top and bottom injectors are disclosed. Methods of operating NVM cells are disclosed. The NVM cell may be NROM, SONOS, or other oxide-nitride technology NVM cells such as SANOS, MANOS, TANOS.

Abstract: Retention of charges in a nonvolatile memory (NVM) cell having a nitride-based injector (such as SiN, SIRN, SiON) for facilitating injection of holes into a charge-storage layer (for NROM, nitride) of a charge-storage stack (for NROM, ONO) may be improved by providing an insulating layer (for NROM, oxide) between the charge-storage layer and the injector has a thickness of at least 3 nm. Top and bottom injectors are disclosed. Methods of operating NVM cells are disclosed. The NVM cell may be NROM, SONOS, or other oxide-nitride technology NVM cells such as SANOS, MANOS, TANOS.

Abstract: A non-volatile memory (NVM) having an array of memory cells and a unidirectional multiplexer (UMUX), the UMUX may be comprised of two or more address line ports adapted to receive addressing signals corresponding with elements in the memory array, and a set of switching transistors adapted to switch a supply voltage in accordance with the addressing signal such that current only flows into the array.

Abstract: The present invention is a method, circuit and system for erasing a non-volatile memory cell. A shunting element (e.g. transistor) may be introduced and/or activated between bit-lines to which one or more NVM cells being erased are connected. The shunting element may be located and/or activated across two bit-lines defining a given column of cells, where one or a subset of cells from the column may be undergoing an erase operation or procedure. The shunting element may be located, and/or activated, at some distance from the two bit-lines defining the given column of cells, and the shunting element may be electrically connected to the bit-lines defining the column through select transistors and/or through global bit-lines.

Abstract: A method of fabricating an oxide-nitride-oxide (ONO) layer in a memory cell to retain charge well in the nitride layer includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer and oxidizing a top oxide layer, thereby causing oxygen to be introduced into the nitride layer. Another method includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer and oxidizing a portion of a top oxide layer, thereby causing oxygen to be introduced into the nitride layer and depositing a remaining portion of the top oxide layer, thereby assisting in controlling the amount of oxygen introduced into the nitride layer. A further method includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer, depositing a portion of a top oxide layer and oxidizing a remaining portion of the top oxide layer, thereby causing oxygen to be introduced into the nitride layer.

Abstract: The pipe effect can significantly degrade flash performance. A method to significantly reduce pipe current and (or neighbor current using a pre-charge sequence) is disclosed. A dedicated read order keeps the sensing node facing the section of the pipe which was pre-charged. The technique involves pre-charging several global bitlines (such as metal bitlines, or MBLs) and local bitlines (such as diffusion bitlines, or DBLs). The pre-charged global bitlines are selected according to a pre-defined table per each address. The selection of the global bitlines is done according to whether these global bitlines will interfere with the pipe during the next read cycle.

Abstract: A method for fabricating a non-volatile memory array includes placing contacts over bit lines in a self-aligned manner. The placing includes forming self-aligned contact holes bounded by a second insulating material resistant to the removal of a first insulating material previously deposited over the bit lines, and depositing contact material, wherein the second insulating material blocks effusion of the contact material beyond the contact holes. The distance between neighboring bit lines in the array does not include a margin for contact misalignment.

Abstract: A method of fabricating an oxide-nitride-oxide (ONO) layer in a memory cell to retain charge well in the nitride layer includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer and oxidizing a top oxide layer, thereby causing oxygen to be introduced into the nitride layer. Another method includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer and oxidizing a portion of a top oxide layer, thereby causing oxygen to be introduced into the nitride layer and depositing a remaining portion of the top oxide layer, thereby assisting in controlling the amount of oxygen introduced into the nitride layer. A further method includes the steps of forming a bottom oxide layer on a substrate, depositing a nitride layer, depositing a portion of a top oxide layer and oxidizing a remaining portion of the top oxide layer, thereby causing oxygen to be introduced into the nitride layer.

Abstract: A method for creating a non-volatile memory array includes implanting pocket implants in a substrate at least between mask columns of a given width and at least through an ONO layer covering the substrate, generating increased-width polysilicon columns from the mask columns, generating bit lines in the substrate at least between the increased-width polysilicon columns and depositing oxide at least between the polysilicon columns.