Patents Assigned to Sparton DeLeon Springs, LLC
  • Patent number: 11877413
    Abstract: A printed circuit board assembly (PCBA) controls an electrically initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: January 16, 2024
    Assignee: Sparton DeLeon Springs, LLC
    Inventors: Lendon L. Bendix, Derek Turner
  • Publication number: 20230009440
    Abstract: A printed circuit board assembly (PCBA) controls an electrically initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 12, 2023
    Applicant: Sparton DeLeon Springs, LLC
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 11477903
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: October 18, 2022
    Assignee: Sparton DeLeon Springs, LLC
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 11056089
    Abstract: A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 ?m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 6, 2021
    Assignee: Sparton DeLeon Springs, LLC
    Inventor: Lendon L. Bendix
  • Patent number: 9597765
    Abstract: A novel optical fiber end structure and method for creating same in which an optical fiber end structure may comprise a cylindrical wedge having a planar surface angled with respect to the longitudinal axis of the optical fiber and a flat surface that is generally perpendicular with the longitudinal axis of the optical fiber. The device and method of the invention may employ a single or plurality of mechanically polished wedges on the end or ends of an optical fiber, which may, in a best mode, be a few mode fiber. The method and device of the invention may be used to independently modulate standing waves or linearly polarized waves, or both, allowing for a modal multiplexed system. The invention radiates independent standing wave modes and/or linearly polarized modes from the dielectric waveguide structure, and may be employed in single, few mode or multimode optical fibers.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: March 21, 2017
    Assignee: Sparton DeLeon Springs, LLC
    Inventors: Barry G Grossman, Brian A Lail, Julius Chatterjee, Lendon Bendix