Patents Assigned to SPC Electronics Corporation
  • Patent number: 8193872
    Abstract: A waveguide circulator which does not cause an arcing phenomenon and deterioration of microwave characteristic, even when a ferrite member generates heat to raise a temperature thereof. The waveguide circulator is composed of a waveguide formed substantially in Y-shape with rectangular waveguides which are provided so as to position horizontally on a predetermined plane, and further they are extended in different three directions from junction positions of the waveguide wherein two ferrite members are placed in the junction positions thereof so as to oppose to each other on the upper and lower sides in the height direction perpendicular to the predetermined plane wherein an extended section extending in the height direction in the vicinities of the junction positions of the waveguides is formed, and a distance between the ferrite members is expanded to compensate decreased impedance.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: June 5, 2012
    Assignee: SPC Electronics Corporation
    Inventors: Toshiharu Ikoma, Mina Iwama
  • Publication number: 20100207701
    Abstract: A waveguide circulator which does not cause an arcing phenomenon and deterioration of microwave characteristic, even when a ferrite member generates heat to raise a temperature thereof. The waveguide circulator is composed of a waveguide formed substantially in Y-shape with rectangular waveguides which are provided so as to position horizontally on a predetermined plane, and further they are extended in different three directions from junction positions of the waveguide wherein two ferrite members are placed in the junction positions thereof so as to oppose to each other on the upper and lower sides in the height direction perpendicular to the predetermined plane wherein an extended section extending in the height direction in the vicinities of the junction positions of the waveguides is formed, and a distance between the ferrite members is expanded to compensate decreased impedance.
    Type: Application
    Filed: February 9, 2010
    Publication date: August 19, 2010
    Applicant: SPC ELECTRONICS CORPORATION
    Inventors: Toshiharu IKOMA, Mina IWAMA
  • Publication number: 20070006904
    Abstract: A substrate cleaning system that cleans a glass substrate by supplying liquid and gas to spray nozzles and by spraying fluid, where the liquid and the gas are mixed in the spray nozzles, onto the substrate in order to effectively remove foreign objects attached on the end surface of substrate after performing mechanical cut-off or polishing treatment, the system has: liquid heating means for heating the liquid to be supplied to the spray nozzles to control the temperature of the liquid, in which the temperature of the liquid at the inlet of the spray nozzles is controlled at 40° C. to 100° C.
    Type: Application
    Filed: June 26, 2006
    Publication date: January 11, 2007
    Applicant: SPC ELECTRONICS CORPORATION
    Inventors: Takehiro Hagiwara, Tatsuo Kataoka, Seiji Noda, Takafumi Nakai
  • Patent number: 7027003
    Abstract: A primary radiator used for a parabolic antenna including: a radiator body having a horn part provided at one end of a waveguide; and a waterproof cover covering an open end of the horn part of the radiator body, wherein a step is formed on an inner surface of the horn part of the radiator body, and a position of the step is set so that radio waves reflected on the waterproof cover are cancelled out by radio waves reflected on the step to prevent multiple reflection in the radiator body.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: April 11, 2006
    Assignees: SPC Electronics Corporation, Funai Electric Co., Ltd.
    Inventors: Masatoshi Sasaki, Tomoyuki Mori, Kenji Obinata
  • Patent number: 6616773
    Abstract: A substrate treatment assembly for treating a work object on a surface of a substrate by supplying to the work object a wet ozone-containing gas wetted with a treatment solution includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, a supply device for supplying the wet ozone-containing gas to a work object on a surface of the substrate, a gas conduit connecting the wetting device to the supply device, and a heating device for heating the wet ozone-containing gas to a temperature approximately equal to or greater than the temperature of the substrate.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: September 9, 2003
    Assignees: Mitsubishi Denki Kabushiki Kaisha, SPC Electronics Corporation
    Inventors: Masaki Kuzumoto, Seiji Noda, Izumi Oya, Makoto Miyamoto, Hideo Horibe, Tatsuo Kataoka, Tetsuji Oishi
  • Patent number: 6432218
    Abstract: A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of foreign matters adhering to the surfaces of the workpieces. A cleaning tank 10 for holding workpieces is provided, a supply line 14 for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank is provided, and a valve 12 for adjusting the flow of the cleaning solution is disposed in the middle of the supply line 14. The valve 12 is equipped with a switching section 12a for controlling the outflow of the cleaning solution by opening or closing the supply line 14, and a bypass 12b for supplying the cleaning solution, bypassing the switching section 12a.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: August 13, 2002
    Assignee: SPC Electronics Corporation
    Inventors: Masatoshi Hirokawa, Haruki Sonoda, Yusuke Abe, Tetsuji Oishi, Masashi Omori, Hiroshi Tanaka