Abstract: A system and method of forming a hermetic seal between a lens or window and a lid, which minimizes bending moments, and therefore, bifringance on the window or lens is disclosed. This is accomplished by use of a transition member, specific geometries, and selection of the coefficient of thermal expansion of the materials to insure that the solder joint is in compression on cool down and solder strains are maintained within acceptable limits. The transition member may be soldered or welded to lid or integral through machining.

Abstract: A coupling and method for forming a hermetic seal between a component and a housing is provided in which a mechanical joint is formed between an exposed interior surface of the component and an exterior surface of a protrusion on the housing. The coefficients of thermal expansion of the connector and the housing are chosen such that the solder joint is in compression during cool down of the solder.

Abstract: A hermetically sealed connector and method for providing the same is provided. Generally, the connector contains a header having a series of pins secured therein, wherein the header has an upper portion that extends in a direction perpendicular to a central axis of a pin within the series of pins. The header also has a lower lip portion that extends in a direction perpendicular to the upper lip portion. The connector also contains an outer body having a series of clearance layers therein that are defined by an inner wall of the outer body, wherein each clearance layer within the series of clearance layers has an associated diameter, and wherein the header is connected to a first portion of the inner wall via a solder joint that extends from the lower lip portion of the header to the first portion of the inner wall. The first portion of the inner wall also has at least two different diameters.

Abstract: The waveguide window assembly disclosed herein is particularly adapted for use in conjunction with a waveguide housing of a high expansion material such as aluminum. The window is formed of a glassy material having a relatively low coefficient of thermal expansion and is provided with a frame of a material having a matching coefficient. The housing is provided with an opening for receiving the frame with substantial clearance. A wall member is interposed between the frame and the edges of the opening with solder filling the space between the wall member and the frame and also the space between the wall member and the edges of the opening, the wall member being constructed of a material having a coefficient of thermal expansion which is intermediate those of the housing material and the frame material.