Abstract: In order to provide an improved heat transfer interface between an solid state device and a heat sink to which it is soldered, one or more “vents” are provided in the interface between the solid state device and the heat sink to prevent the entrapment of gases that could form solder voids. Advantageously, the provision of such vents in the interface surface geometry of the semiconductor may be effected by the use of appropriate masking and etching following the epitaxial regrowth process. Alternatively, the heat sink or a solder preform may be provided with suitable notches. The use of such “die-bond vents” also allows solder, after melting, to be forced under the chip by external gas pressure such that no solder voids are left.

Abstract: A surface-emitting distributed feedback (SEDFB) laser is provided with a “fan-shaped” grating comprising a group of generally straight lines radiating from a central point that is away from the center of the gain. Such a grating provides better stability against self-induced filamentation and dynamic instabilities that limit achievable beam quality, especially in lasers having a stripe length greater than 1 mm.

Abstract: A prismatic device for reforming the cross section of the beam emitted along a semiconductor laser bar stripe by deflecting successive segments of the emitted beam in directions making acute angles with the longitudinal axis of the emitted beam and redirecting the deflected beam segments through layers of glass into an array of parallel beam segments.