Patents Assigned to Spectrum Ceramics, Inc.
  • Patent number: 4572924
    Abstract: A hermetically sealable enclosure for an electronic device. Layers of solder glass bond the lead frame to the enclosure base and to a metallic seal ring. The base and ring can be coated with thin layers of aluminum to promote bonding. The surfaces of the base and ring can be roughened to promote bonding.
    Type: Grant
    Filed: May 18, 1983
    Date of Patent: February 25, 1986
    Assignee: Spectrum Ceramics, Inc.
    Inventors: Wilbur T. Wakely, Philip R. Scott