Patents Assigned to Spectrum Signal Processing Inc.
  • Patent number: 7082487
    Abstract: CMC boards have standardized dimensions for an “I/O envelope” (to accommodate components for I/O functions) and a “component envelope” (to accommodate components for core board functions). Daughter cards are developed (mainly to perform I/O functions but also to perform core board functions, if desired) that fit within the standardized dimensions of the I/O envelope.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: July 25, 2006
    Assignee: Spectrum Signal Processing, Inc.
    Inventors: Mohammad Darwish, Leonard G. Pucker, Phillip D. Smith, Roy Gee Leong Woo
  • Patent number: 6845131
    Abstract: For a low voltage differential signalling technology to achieve more and faster processing, minimizing power consumption is important. A method of power management is provided whereby the transmitter circuitry is powered down at appropriate times and a minimum number of active links is maintained to maintain the integrity of the state of the logic in the receiver circuitry.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: January 18, 2005
    Assignee: Spectrum Signal Processing Inc.
    Inventors: Vivian John Ward, John Peter Van Baarsen
  • Publication number: 20040103133
    Abstract: If there are N inputs into a decimate-by-M filter, a plurality (N/M) of decimate-by-N sub-filters is configured in parallel. Each decimation sub-filter outputs one sample, resulting in an aggregate of (N/M) output samples per processing cycle. The inputs to each sub-filter should be out of phase by M samples.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 27, 2004
    Applicant: Spectrum Signal Processing Inc.
    Inventor: Paul Thomas Gurney