Patents Assigned to Speedfam-IPEC, Inc.
  • Method and apparatus for improved semiconductor wafer polishing
    Patent number: 6102779
    Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: August 15, 2000
    Assignee: Speedfam-IPEC, Inc.
    Inventors: Joseph V. Cesna, Inki Kim