Abstract: A fluid delivery system is provided for delivering a fluid to a polishing surface of a chemical mechanical polishing tool. The system includes a polishing pad having a plurality of apertures, a plurality of layers having a network of grooves and a platen having an aperture. A fluid may be communicated to the aperture in the platen, through the grooves in the plurality of layers and finally through the plurality of apertures in the polishing pad. The size, position and number of apertures in the platen and the polishing pad and the size, position and number of grooves in each of the layers may be varied to control the distribution of fluid across the top surface of the polishing pad. Preferably, the distance a fluid must travel from the platen aperture through the grooves to any of the apertures in the polishing pad is substantially the same.