Patents Assigned to Speedram Corporation
  • Method and apparatus for improved semiconductor wafer polishing
    Patent number: 5993293
    Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: November 30, 1999
    Assignee: Speedram Corporation
    Inventors: Joseph V. Cesna, Inki Kim