Abstract: An electrical circuit panel having provisions for mitigating joint failure of soldered connections thereof. An electrical conductor is formed by an electrically conductive coating(s) on a support. The conductor has a discontinuity formed therein which exposes a portion of the support or an underlying second conductor that is non-solderable. An electrically conductive bridge plate is soldered into electrically conductive engagement with the conductor at two distinct spaced positions along the plate, the two positions being located on opposite sides of the discontinuity. The bridge plate may be arched between the two positions if desired, and the panel as a whole may comprise an electrical resistance heating panel.