Patents Assigned to SPM Semiconductor Products Manufacturing
  • Patent number: 6336669
    Abstract: In an automatic chip test machine for testing electronic components, a novel quick disconnect articulated chuck for securing a chip nest, allowing rapid changes of the chuck and plunger head with minimum production downtime. The chuck is comprised of a chuck base and a quick disconnect assembly. The quick disconnect assembly includes a vacuum seal a retractable piston with vacuum cup attachment for securing a chip, a plunger head, alignment pins, and accessible disconnect screws. The base housing is mounted in a manner that permits articulation of the chuck to allow the chuck to align with the electrical test fixture; and a vacuum introduction port. A slide frame is supported on slide rails with a roller ball and detent mechanism to permit relatively low forces of the initial mating action between the chuck and the fixture to move the chuck into a position of better alignment, and therefore lower stress and wear.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: January 8, 2002
    Assignee: SPM Semiconductor Products Manufacturing
    Inventor: Wilburn B. Laubach