Patents Assigned to SPM Technology, Inc.
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Patent number: 8556684Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.Type: GrantFiled: February 19, 2013Date of Patent: October 15, 2013Assignee: SPM Technology, Inc.Inventors: William B. Sather, Adam W. Manzonie
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Patent number: 8517803Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.Type: GrantFiled: September 16, 2009Date of Patent: August 27, 2013Assignee: SPM Technology, Inc.Inventors: William B. Sather, Adam W. Manzonie
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Publication number: 20130165028Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.Type: ApplicationFiled: February 19, 2013Publication date: June 27, 2013Applicant: SPM TECHNOLOGY, INC.Inventor: SPM TECHNOLOGY, INC.
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Patent number: 8298046Abstract: Retaining rings are presented with specially designed inserts that increase rigidity and improve heat dissipation. Inserts that are more rigid, and that have better ability to conduct heat, are inserted into pockets positioned along the outer portion of the rings. The pockets do not compromise the upper, lower or inner portion of the rings. Because the inserts are more rigid than the material used in the body of the ring, they absorb the deforming forces resulting from fastening the ring to the carrier head. Because they are better conductors than the material used in the body of the ring, the ring is better able to dissipate heat generated during polishing. Moreover, because the inserts are positioned in the outer portion of the ring, the inserts are not exposed to the polishing surface during polishing and therefore are less likely to react undesirably with the chemicals used during polishing.Type: GrantFiled: April 16, 2010Date of Patent: October 30, 2012Assignee: SPM Technology, Inc.Inventors: George J. Frank, Jr., Adam W. Manzonie, William B. Sather
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Publication number: 20110065368Abstract: An improved retaining ring used for chemical mechanical polishing of substrates, such as semiconductor wafers, to hold a substrate in place during the polishing process. The retaining rings are configured with inserts through which fasteners are positioned to securely affix the retaining ring to the polishing head. The inserts assist in dissipating the force of the fasteners, thereby allowing a more uniform polishing surface. The opening through which the fastener is positioned may be configured with concave or convex side walls to assist in dissipating the force of the fasteners during installation of the retaining ring or the polishing process.Type: ApplicationFiled: September 16, 2009Publication date: March 17, 2011Applicant: SPM Technology, Inc.Inventors: William B. Sather, Adam W. Manzonie