Abstract: A substrate processing apparatus 10 includes a holding table 20 for rotatably holding a wafer W, a nozzle 40 for supplying chemical solutions L1 and L2 to the wafer W, at least one light irradiation units G1 and G2, and a pot 30 placed in the outer radius of the holding table 20for collecting the processing solutions L1 and L2 that are scattered from the wafer W. The pot 30 also includes a cover 70 that can be moved in the direction of the axis of the holding table 20so that a plurality of chemical solution collecting chambers M1 and M2 are formed in the pot by changing the position of the cover 70.
Abstract: A method for vacuum drying of a substrate which can eliminate not only the moisture adhered to the substrate surface but also the moisture impregnated inside of the films which form the devices in a shot time without deforming nor deteriorating the devices formed on the substrate in the drying. The method for vacuum drying of a substrate, concerning a method for drying a substrate by processing the substrate surface in a desired condition, cleaning the processed substrate with cleaning liquid, and drying the cleaned substrate, comprises the steps of heating the substrate surface to a predetermined temperature to vaporize the moisture of the surface as vapor and thereby detach the moisture from the substrate to outside, and vacuuming the detached vapor at a predetermined vacuum pressure to eliminate the moisture from the wafer.
Abstract: A method for cleaning a substrate with sherbet-like composition, comprising mixing the liquid organic agent and pure water in a mixing vessel to form a mixture, supercooling the mixture uniformly at a predetermined temperature while stirring the mixture, wherein the stirring includes creating vortices in the mixture, growing the vortices and diffusing the grown vortices in the mixture, thus providing sherbet-like cleaning composition and moving the sherbet-like cleaning composition relative to the substrate to be cleaned.
Abstract: The apparatus for cleaning a substrate comprises cleaning chambers each of which is disposed on a respective side with reference to a clearance therebetween. The apparatus further comprises a plurality of chucks which clamp the substrate to be cleaned and move the substrate between the inside the clearance between the cleaning chambers and the outside thereof, a pair of screws each of which is disposed to be rotatable and close to a respective surface of the substrate when the substrate is introduced into the clearance between the cleaning chambers, liquid supplying nozzles which supply the screws with pure water or mixed liquid including pure water and medicinal liquid, and snow ice supplying nozzles which supply the screws with snow ice having a predetermined granular diameter. The opposite surfaces of the substrate are cleaned by rotating pure water or mixed liquid including pure water and medicinal liquid by means of the screws to press it against the opposite surfaces of the substrate.