Abstract: An electric field is provided in a first direction between an anode and a target having a flat disposition. A magnetic field is provided such that the magnetic flux lines are in a second direction substantially perpendicular to the first direction. The magnet structure may be formed from permanent magnets extending radially in a horizontal direction, like the spokes of a wheel, and from magnetizable pole pieces extending vertically from the opposite ends of the spokes. The permanent magnets and the pole pieces define a well. The target is disposed in the well so that its flat disposition is in the same direction as the magnetic flux lines. Molecules of an inert gas flow through the well. Electrons in the well move in a third direction substantially perpendicular to the first and second directions. The electrons ionize molecules of the inert gas. The ions are attracted to the target and sputter atoms from the surface of the target. The sputtered atoms become deposited on a substrate.

Abstract: An electrical field between a positive anode and a negative target in a cavity and a magnetic field in the cavity cause electrons from the target to ionize neutral gas (e.g. argon) atoms in the cavity. The ions cause the target to release sputtered atoms (e.g. aluminum) for deposition on a substrate. A shield between the target and the substrate inhibits charged particle movement to the substrate. The anode potential may be positive, and the shield and the magnetic members may be grounded, to obtain electron movement to the anode, thereby inhibiting the heating of the shield and the magnetic members by electron impingement. The anode may be water cooled. The magnitude of the positive anode voltage relative to the target voltage provides selectively for (a) a uniform thickness of sputtered atoms on the walls of a groove in the substrate or (b) a filling of the groove by the sputtered atoms and a uniform thickness of deposition on the substrate surface including the filled groove.

Abstract: A conductive adhesion layer (e.g. titanium 150 .ANG. thick) is formed on a substrate. A first conductive barrier layer (e.g. high-density gold-colored titanium-nitride 300 .ANG. thick) having properties of microcracking in a first direction to relieve inherent stress is deposited on the conductive adhesion layer. A second conductive barrier layer (e.g. low-density brown-colored titanium-nitride 400 .ANG. thick) having properties of low inherent stress is deposited on the first barrier layer. The second barrier layer may be exposed to air, thereby further inhibiting the leakage to the substrate of material from a conductive layer (e.g. aluminum silicon copper or aluminum copper) when a third barrier layer (e.g. high-density gold-colored titanium nitride 300 .ANG. thick) and such conductive layer are thereafter sequentially deposited on the second barrier layer. Such method may be used to provide a substantially uniform deposition on the walls of a groove for receiving a via. An insulating coating (e.g.

Abstract: This invention relates to apparatus for, and methods of, providing controlled depositions on substrates. The substrates are particularly adapted to provide die for use as the spacers in magnetic heads to dispose the magnetic heads in almost abutting relationship to a memory medium such as a disc and to protect the heads against damage by the disc if the disc should contact the heads while the disc is rotating at a high speed.This invention is particularly concerned with an end effector apparatus disposed in a transport module between a cassette module on one side of the transport module and a process module on the other side of the transport module. The end effector apparatus provides a controlled transfer of substrates between a cassette holder in the cassette module and apparatus disposed in the process module for producing a controlled deposition on the substrate.

Abstract: An electrical field between a positive anode and a negative target in a cavity and a magnetic field in the cavity produce electron flow from the target in a convoluted path for ionizing a gas such as oxygen flowing through the cavity. The ionized oxygen forms positive and negative oxygen ions which flow from the cavity to an aluminum oxide surface on a substrate. The aluminum oxide surface may contain hydrocarbon molecules which prevent a thin magnetizable layer from adhering uniformly on the aluminum oxide surface. The ionized oxygen molecules and atoms flow through the cavity at a reduced rate and react chemically with the hydrocarbon molecules to form water vapor and carbon monoxide and/or carbon dioxide gases. By removing the hydrocarbons from the aluminum oxide surface, the layer of the magnetizable material is deposited adheringly on the aluminum oxide surface. A neutral gas (e.g.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A target, preferably frusto-conical, defines a cavity with an anode. Molecules of a neutral gas (e.g. argon) pass through the cavity at a particular rate. An alternating voltage is applied between the anode and the cathode. When the anode voltage is positive relative to the cathode, electrons are emitted from the cathode and are directed to the anode. A magnetic field is produced on the electrons in a direction transverse, preferably substantially perpendicular, to the electrical field. The magnetic field causes the electrons to travel in a spiral path between the anode and the target, thereby enhancing the ionization rate of the argon molecules passing through the cavity. The positive argon ions impinge on the target and cause atoms to be sputtered from the target surface. These atoms become deposited on a surface of a substrate displaced from the target.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: An electrical field between a positive anode and a negative target in a cavity and a magnetic field in the cavity cause electrons from the target to ionize neutral gas (e.g. argon) atoms in the cavity. The ions cause the target to release sputtered atoms (e.g. aluminum) for deposition on a substrate. A shield between the target and the substrate inhibits charged particle movement to the substrate. The anode potential may be positive, and the shield and the magnetic members may be negative relative to the anode, to obtain electron movement to the anode, thereby inhibiting the heating of the shield and the magnetic members by electron impingement. The anode may be water cooled. The magnitude of the positive anode voltage relative to the target voltage provides selectively for (a) a uniform thickness of sputtered atoms on the walls of a groove in the substrate or (b) a filling of the groove by the sputtered atoms and a uniform thickness of deposition on the substrate surface including the filled groove.

Abstract: A robotic arm assembly in a transport module is expansible to have an effector at its end receive a substrate in a cassette module and is then contracted and rotated with the effector to have the effector face a process module. Planets on a turntable in the process module are rotatable on first parallel axes. The turntable is rotatable on a second axis parallel to the first axes to move successive planets to a position facing the effector. At this position, an alignment assembly is aligned with, but axially displaced from, one of the planets. This assembly is moved axially into coupled relationship with such planet and then rotated to a position aligning the substrate on the effector axially with such planet when the arm assembly is expanded. A lifter assembly aligned with, and initially displaced from, such planet is moved axially to lift the substrate from the effector. The arm assembly is then contracted, rotated with the effector and expanded to receive the next cassette module substrate.

Abstract: A method wherein wafers are transferred between a loading chamber and a central vacuum chamber. A plurality of first vacuum processing chambers are disposed in a satellite relationship around the central chamber. A plurality of second non-vacuum chambers are interspersed with the first chambers in a satellite relationship around the central chamber. A second central vacuum chamber communicates with one of the first chambers through a valve. Third and fourth pluralities of chambers are disposed in a satellite relationship around the second central chamber to respectively perform functions similar to those performed by the first and second chambers, the fourth chambers being interspersed with the third chambers.

Abstract: A target releases electrons to an anode through a cavity containing gaseous atoms (e.g. argon) having properties of becoming ionized by electron impingement. Magnetic and electrical fields increase the distance of electron travel between the anode and the target, thereby enhancing ion formation from the gaseous atoms. The ions bombard the target and cause it to emit sputtered atoms (e.g. aluminum) which are deposited on a substrate (e.g. wafer) displaced from the target. In one embodiment, a shield disposed between the target and the substrate is shaped, and has a potential, to attract charged particles and prevent them from moving to the substrate. This allows the wafer to be disposed close to the target, thereby enhancing the density, and the thickness uniformity, of the deposition on the substrate. The shield also acts as a getter to remove impurities (e.g. water molecules) from the space between the target and the substrate.

Abstract: Electrons released by an anode are attracted by an electric field toward a target cathode in a cavity to ionize argon atoms in the space between the anode and target. Magnets produce a magnetic field in the cavity in a direction perpendicular to the electrical field to produce a trapping spiral movement of the electrons in the cavity, thereby enhancing the ionization of the gaseous molecules. The ions bombard the target to emit sputtered atoms which are deposited on a semi-conductor wafer. The target may have a frusto-conical configuration defined by a single member or by a plurality of segmental tiles formed from different materials to provide for a deposition of a mixture of such different materials on the wafer. The target may be magnetizable.

Abstract: A sputter coating machine includes a rectilinearly translatable load-lock door closing off one end of an evacuable chamber. Wafers to be coated are loaded and unloaded by an elevator blade onto a chuck carried from the inside surface of the door. A clamping ring clamps the wafer to the chuck and advances the wafer through the open throat of a gate-valve portion of the chamber into position opposite a magnetron sputter gun carried from a second door closing off the other end of the chamber. The second door is movable away from the chamber on guide rails and pivotable about an axis for ease of maintenance.

Abstract: A sputter coating machine (11) includes a rectilinearly translatable load-lock door (16) closing off one end of a vacuumable chamber (12). Wafers (21) to be coated are loaded and unloaded by an elevated blade (24) onto a chuck (57) carried from the inside surface of the door (16). A clamping ring (85) clamps the wafer (21) to the chuck (57) and advances the wafer (21) to the open throat of a gate-valve portion (15) of the chamber (12) into position opposite a magnetron-sputter gun (105) carried from a second door end of the chamber (12). The second door (13) is moveable away from the chamber (12) on guide rails (141) and pivotable about an axis (138) for ease of maintenance.