Abstract: A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. Alternate embodiments show the heat sink which has a snap on flange to attach the heat sink to the adaptor and the adaptor extending down to engage with the socket in which the microprocessor is installed.

Abstract: A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. An alternate embodiment shows the heat sink which has a snap on flange to attach the heat sink to the adaptor.

Abstract: System, including a U-shaped handle, that is swingable about an axis passing through the ends of its legs and selectably lockable in an operative position or an inoperative storage position.