Patents Assigned to ST Assembly Test Services
  • Dual row leadframe and fabrication method
    Publication number: 20050260787
    Abstract: A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.
    Type: Application
    Filed: May 13, 2004
    Publication date: November 24, 2005
    Applicant: ST ASSEMBLY TEST SERVICES
    Inventors: Jeffrey Punzalan, Jose Caparas, Jae Ku
  • Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing
    Patent number: 6242933
    Abstract: A new probe socket is provided that allows for high speed and dependable contacting of points of contact on the Device Under Test. The new probe socket is aimed at a testing environment where semiconductor devices are mounted on device or package strips.
    Type: Grant
    Filed: October 4, 1999
    Date of Patent: June 5, 2001
    Assignee: ST Assembly Test Services
    Inventor: Liop-Jin Yap