Patents Assigned to ST Assembly Test Services Inc.
  • System for semiconductor package with stacked dies
    Patent number: 6833287
    Abstract: A semiconductor package with stacked dies and method of assembly is provided. A first die is attached to a substrate. A protective layer is placed on the first die over a central area thereof. The first die is electrically connected to the substrate. An intermediate adhesive layer is applied over the protective layer. A second die is attached to the intermediate adhesive layer and electrically connected to the substrate.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: December 21, 2004
    Assignee: ST Assembly Test Services Inc.
    Inventors: Hyeong Ryeol Hur, Henry D. Bathan, Zigmund R. Camacho