Abstract: An Integrated Circuit package structure includes an Integrated Circuit device having a electrical contact points to the device in the bottom surface. A heatsink has a flat bottom surface extending past the device by a first distance and contacting the top surface of the device. A substrate has a flat upper surface extending past the device by the first distance and having points of electrical contact to the device and a lower surface having points of electrical contact for further interconnect of the substrate to surrounding circuitry or components with the upper and lower surfaces extending beyond the bottom surface of the device. A molding compound is between the flat bottom surface of the heatsink and the flat upper surface of the substrate to fill only the first distance and is among the points of electrical contact to the device.

Abstract: The present invention provides a kit and method for package-to-package conversion of a pick and place handler. An input arm assembly is provided with interchangeable vacuum leads such that package-to-package conversion only requires replacing the vacuum lead with a different size vacuum lead. An input/output shuttle plate is provided comprising a block and base plate. The block has a plurality of pocket groupings and a two or more alignment hole groupings. The base plate has two or more alignment pins. Package-to-package conversion is achieved by changing which alignment hole in each alignment hole grouping is set on the alignment pins, thereby selecting the pocket in each pocket grouping corresponding to the alignment hole used. A soak plate is provided having an array of pocket groupings, wherein each pocket grouping has the same pattern of different size/shape pockets to accommodate different packages.