Abstract: Described are a chemical-mechanical polishing (CMP) composition comprising abrasive particles in the form of organic/inorganic composite particles as well as the use of said composite particles as abrasive particles in a CMP composition and processes for the manufacture of a semiconductor device comprising chemical mechanical polishing of a substrate in the presence said CMP composition.
Type:
Grant
Filed:
July 24, 2015
Date of Patent:
February 26, 2019
Assignees:
ST. LAWRENCE NANOTECHNOLOGY, BASF TAIWAN LTD., BASF CORPORATION