Patents Assigned to ST. LAWRENCE NANOTECHNOLOGY
  • Patent number: 10214663
    Abstract: Described are a chemical-mechanical polishing (CMP) composition comprising abrasive particles in the form of organic/inorganic composite particles as well as the use of said composite particles as abrasive particles in a CMP composition and processes for the manufacture of a semiconductor device comprising chemical mechanical polishing of a substrate in the presence said CMP composition.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: February 26, 2019
    Assignees: ST. LAWRENCE NANOTECHNOLOGY, BASF TAIWAN LTD., BASF CORPORATION
    Inventors: Yongqing Lan, Bastian Marten Noller, Yuzhuo Li, Liang Jiang, Daniel Kwo-Hung Shen, Reza Golzarian