Abstract: A sensor chip protective image sensor packaging method includes the steps of a) installing an image sensor chip in a circuit substrate and then covering a passivation layer on a sensing zone of the image sensor chip, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, d) removing the passivation layer, and e) mounting a light transmissive cover in the encapsulation over the sensing zone of the image sensor chip. Thus, the passivation layer protects the sensing zone of the image sensor chip against contamination and damage prior before having been protected by the cover, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern thereon and the conductor pattern has a plurality of pads. A first die is mounted on the substrate and is electrically connected to the pads of the conductor pattern by gold wires. A first insulating layer is mounted on the substrate to cover the first die and the gold wires. A mask, which has a top and an annular sidewall, is mounted on the substrate to cover the first insulating layer and the first die. A second die is mounted on the top of the mask and is electrically connected to the pads of the connector pattern by gold wires. A second insulating layer is mounted on the substrate to cover the second die and the gold wires.

Abstract: An image capture device comprises a substrate having a first side, a second side, a cavity running through the substrate from the first side to the second side and a conductor pattern. An image sensor is provided on the first side of the substrate to cover the cavity. A first die is provided in the cavity of the substrate and is bonded to a bottom of the image sensor. A second die is stacked on the first die. An insulating layer is provided on the second side of the substrate to cover the first die and the second die, and a frame is provided on the first side of the substrate to receive the image sensor therein. The frame has a window in which lenses are mounted.