Abstract: A method of package for sensor chip includes the steps of: a) providing a sensor chip having a plurality of conducting contacts and a sensing area, b) using an adhesive to bond the sensor chip on a circuit substrate, c) mounting a dam between the sensing area and conducting contacts of the sensor chip, d) connecting metal conducting wires between the conducting contacts of the circuit substrate and the conducting contacts of the sensor chip, and e) molding a molding compound on the circuit substrate and the sensor chip to cover the metal conducting wires and the dam. Thus, the dam can buffer the impact of stress on the sensor chip during the step e). Further, an open type sensing space is defined after the step e), facilitating signal or status sensing and improving the sensor chip package yield rate.

Abstract: A sensor chip protective image sensor packaging method includes the steps of a) installing an image sensor chip in a circuit substrate and then covering a passivation layer on a sensing zone of the image sensor chip, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, d) removing the passivation layer, and e) mounting a light transmissive cover in the encapsulation over the sensing zone of the image sensor chip. Thus, the passivation layer protects the sensing zone of the image sensor chip against contamination and damage prior before having been protected by the cover, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: A image sensor packaging method includes the steps of: a) installing an image sensor chip in a circuit substrate and then covering a light transmissive cover on the image sensor chip over a sensing zone of the image sensor chip and then covering a passivation layer on the light transmissive cover, b) using a plurality of lead wires to connect respective conducting contacts of the circuit substrate to respective conducting contacts of the image sensor chip, c) molding an encapsulation on the circuit substrate and the image sensor chip to wrap the lead wires, and d) removing the passivation layer. Thus, the light transmissive cover and the passivation layer protect the sensing zone of the image sensor chip and the light transmissive cover against contamination and damage, and therefore, this image sensor chip packaging method has high-yield performance.

Abstract: A method for fabricating a stacked semiconductor device has the steps of: a) Attach a temporary base on a side of a substrate having a conductor pattern and a cavity. b) Provide a first die in the cavity of the substrate and attach it on the temporary base and electrically connect it to the conductor pattern via wires. c) Stack a second die on the first die and electrically connect it to the conductor pattern via wires. d) Provide an insulating layer on the substrate and in the cavity to embed the first die and the second die, and e) remove the temporary base.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern and a cavity. A first die is received in the cavity of the cavity of the substrate and is electrically connected to the conductor pattern via wires. An adhesive layer is printed on a top of the first die. A second die is stacked on the first die via the adhesive layer and is electrically connected to the conductor pattern via wires, and An insulating layer provided on the substrate, wherein the insulating layer cover the first die and the second die and has a portion thereof received in the cavity to bond the first die.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern thereon and the conductor pattern has a plurality of pads. A first die is mounted on the substrate and is electrically connected to the pads of the conductor pattern by gold wires. A first insulating layer is mounted on the substrate to cover the first die and the gold wires. A mask, which has a top and an annular sidewall, is mounted on the substrate to cover the first insulating layer and the first die. A second die is mounted on the top of the mask and is electrically connected to the pads of the connector pattern by gold wires. A second insulating layer is mounted on the substrate to cover the second die and the gold wires.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern and a die bonding portion. A first die is bonded on the die bonding portion of the substrate and is electrically connected to the conductor pattern via wires. A first adhesive layer provided on the substrate to cover the first die and the wires. The first adhesive layer has a greater top on which a second die is bonded. The second die is greater than the first die and is electrically connected to the pads of the conductor pattern via wires. A second adhesive layer provided on the substrate to cover the second die and the wires.

Abstract: An image capture device comprises a substrate having a first side, a second side, a cavity running through the substrate from the first side to the second side and a conductor pattern. An image sensor is provided on the first side of the substrate to cover the cavity. A first die is provided in the cavity of the substrate and is bonded to a bottom of the image sensor. A second die is stacked on the first die. An insulating layer is provided on the second side of the substrate to cover the first die and the second die, and a frame is provided on the first side of the substrate to receive the image sensor therein. The frame has a window in which lenses are mounted.