Abstract: A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.