Patents Assigned to Star Technologies Inc.
  • Patent number: 11714908
    Abstract: Techniques and architectures for representing data with one or more n-dimensional representations and/or using one or more models to identify malware are described herein. For example, the techniques and architectures may determine one or more coordinates for one or more points based on one or more sets of bits in the data and generate an n-dimensional representation for the data based on the one or more points. The techniques and architectures may evaluate the n-dimensional representation with one or more machine-trained models to detect malware.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: August 1, 2023
    Assignee: Quantum Star Technologies Inc.
    Inventor: Garrett Thomas Oetken
  • Patent number: 11307246
    Abstract: A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: April 19, 2022
    Assignee: Star Technologies, Inc.
    Inventors: Choon Leong Lou, Yi Ming Lau
  • Patent number: 11217649
    Abstract: A method for testing and analyzing a display panel, comprising: providing a display panel including a circuitry and a pixel connected to the circuitry, wherein the pixel includes a capacitor, a transistor and an electrode electrically connected to the capacitor and the transistor; measuring a first parameter of the display panel; disabling the pixel; measuring a second parameter of the display panel; and deriving a third parameter of the pixel by subtracting the second parameter from the first parameter.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: January 4, 2022
    Assignee: Star Technologies, Inc.
    Inventor: Choon Leong Lou
  • Patent number: 8988092
    Abstract: A probing apparatus for semiconductor devices provides a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: March 24, 2015
    Assignee: Star Technologies Inc.
    Inventors: Chen Jung Hsu, Chao Cheng Tseng
  • Patent number: 8692570
    Abstract: A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: April 8, 2014
    Assignee: Star Technologies Inc.
    Inventors: Choon Leong Lou, Chih Kun Chen
  • Patent number: 8389926
    Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: March 5, 2013
    Assignee: Star Technologies Inc.
    Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
  • Patent number: 8310264
    Abstract: A method for configuring a combinational switching matrix comprises the steps of setting a first switching module and a second switching module, coupling at least one of the output ports of the first switching module with at least one of the input ports of the second switching module to form the combinational switching matrix, building a connection mapping table based on the coupling relationship between the output port of the first switching module and the input port of the second switching module, and displaying a channel switching interface showing the input terminals, the output terminals, and the on/off states of the virtual switching devices of the combinational switching matrix.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: November 13, 2012
    Assignee: Star Technologies Inc.
    Inventors: Choon Leong Lou, Hsiao Hui Hsieh
  • Patent number: 8279451
    Abstract: One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: October 2, 2012
    Assignee: Star Technologies Inc.
    Inventors: Yong Yu Liu, Choon Leong Lou, Lai Peng Chew
  • Patent number: 8198725
    Abstract: An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width larger than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuit package.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: June 12, 2012
    Assignee: Star Technologies Inc.
    Inventor: Choon Leong Lou
  • Patent number: 8188758
    Abstract: An enclosed probe station comprises a chuck assembly, a supporting member and an enclosure. The chuck assembly is configured to support a device under test. The supporting member is configured to secure a probe used to contact the device under test. The enclosure forms an interior space in which the chuck assembly and the supporting member are disposed.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: May 29, 2012
    Assignee: Star Technologies, Inc.
    Inventor: Choon Leong Lou
  • Patent number: 8169227
    Abstract: A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: May 1, 2012
    Assignee: Star Technologies Inc.
    Inventor: Choon Leong Lou
  • Patent number: 8035405
    Abstract: A probing apparatus includes a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: October 11, 2011
    Assignee: Star Technologies Inc.
    Inventor: Choon Leong Lou
  • Patent number: 7986157
    Abstract: A probing apparatus for semiconductor devices includes a housing configured to define a testing chamber, a device holder positioned in the housing and configured to receive at least one device under test, and at least one probe stage positioned in the housing. In one embodiment of the present disclosure, the probe stage includes a base, a retaining arm pivotally coupled with the base and having a retaining portion configured to retain at least one probe, and a stepper positioned on the base. In one embodiment of the present disclosure, the stepper is configured in response to an electric signal to move the probe downward through the retaining arm to contact a device under test and to move the probe upward through the retaining arm to separate from the device under test such that the up-and-down movement of the probe can be performed at relatively high frequency of typically greater than six cycles per second.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: July 26, 2011
    Assignee: Star Technologies Inc.
    Inventor: Yong Yu Liu
  • Patent number: 7928749
    Abstract: A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: April 19, 2011
    Assignee: Star Technologies Inc.
    Inventor: Choon Leong Lou
  • Patent number: 7791363
    Abstract: A low temperature probing apparatus comprises a housing, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, a platen positioned on the housing, at least one hydraulic stage positioned on the platen and configured to retain at least one probe, a cover positioned on the platen and configured to form an isolation chamber with the hydraulic stage and the device holder positioned therein, and a hydraulic controller configured to control the movement of the hydraulic stage.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: September 7, 2010
    Assignee: Star Technologies Inc.
    Inventor: Choon Leong Lou
  • Patent number: 7675307
    Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.
    Type: Grant
    Filed: March 18, 2008
    Date of Patent: March 9, 2010
    Assignee: Star Technologies Inc.
    Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
  • Patent number: 7616018
    Abstract: A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: November 10, 2009
    Assignee: Star Technologies Inc.
    Inventors: Choon Leong Lou, Li Min Wang
  • Publication number: 20090237102
    Abstract: A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.
    Type: Application
    Filed: March 18, 2008
    Publication date: September 24, 2009
    Applicant: Star Technologies Inc.
    Inventors: Choon Leong Lou, Li Min Wang, Yi Ming Lau, Ho Yeh Chen
  • Patent number: 7576553
    Abstract: A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: August 18, 2009
    Assignee: Star Technologies Inc.
    Inventors: Choon-Leong Lou, Li Min Wang
  • Publication number: 20090128897
    Abstract: A microscope comprises an object splitter and a plurality of image-outputting devices configured to receive object images. The object splitter includes a first beam splitter configured to direct an illumination light to an object, a positive lens configured to collect a reflected light from the object and focus the reflected light on the first beam splitter, a second beam splitter configured to split the reflected light into a plurality of optical paths and a plurality of negative lenses positioned on the optical paths to render object images. A probing apparatus for an integrated circuit device comprises at least one probe pin configured to contact a pad of the integrated circuit device and a microscope including an object splitter and a plurality of image-outputting devices configured to receive images from the object splitter.
    Type: Application
    Filed: January 17, 2008
    Publication date: May 21, 2009
    Applicant: Star Technologies Inc.
    Inventors: Yong Yu Liu, Choon Leong Lou