Abstract: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

Abstract: A probing apparatus for semiconductor devices provides a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.

Abstract: A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.

Abstract: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

Abstract: A switching matrix includes a plurality of input ports, a plurality of output ports, a plurality of switching devices configured to open and close, an electrical connection between the input ports and the output ports, and an electrical sensor configured to generate a signal by measuring a predetermined electrical property of the electrical connection, the open and close of switching devices is pre-determined by status read from the electrical sensor.

Abstract: A sensing module for light-emitting devices includes a circuit board having at least one retaining region configured to retain an optical sensor, at least one circuit configured to electrically connect the optical sensor to an output interface at a front end of the circuit board, a substrate positioned on the circuit board and having at least one aperture exposing the retaining regions, and an optical device positioned on the aperture and configured to collect emitting lights from a light-emitting device to the retaining region through the aperture.

Abstract: In one embodiment of the present invention, a high frequency circuit board includes a laminate having a top surface with a groove; a semi-rigid cable positioned in the groove of the laminate; and a passivation layer filling the groove; wherein the semi-rigid cable is configured to transmit a high frequency signal, and the semi-rigid cable comprises a central conductor, an outer conductor, and an insulating layer between the central conductor and the outer conductor.

Abstract: The present invention discloses a calibration system for electronic devices comprising an electronic calibration device and an electronic device and having a space configured to connect to the electronic calibration device. The electronic calibration device has a calibration parameter storage module configured to pre-store a first standard parameter of a plurality of calibration items of the electronic device.

Abstract: A probing apparatus for semiconductor devices comprises a primary circuit board and a signal-adapting board positioned on the primary circuit board. The primary circuit board includes an inner area having a plurality of first contacts and an outer area having a plurality of first terminals and second terminals, and the first contacts are electrically connected to the first terminals via first conductive members in the primary circuit board. The signal-adapting board includes a plurality of second contacts electrically connected to the first contacts via second conductive members in the signal-adapting board.

Abstract: A method for configuring a combinational switching matrix comprises the steps of setting a first switching module and a second switching module, coupling at least one of the output ports of the first switching module with at least one of the input ports of the second switching module to form the combinational switching matrix, building a connection mapping table based on the coupling relationship between the output port of the first switching module and the input port of the second switching module, and displaying a channel switching interface showing the input terminals, the output terminals, and the on/off states of the virtual switching devices of the combinational switching matrix.

Abstract: One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.

Abstract: An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width larger than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuit package.

Abstract: A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes.

Abstract: A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact.

Abstract: One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.

Abstract: A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.

Abstract: A probing apparatus includes a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.

Abstract: A probing apparatus for semiconductor devices includes a housing configured to define a testing chamber, a device holder positioned in the housing and configured to receive at least one device under test, and at least one probe stage positioned in the housing. In one embodiment of the present disclosure, the probe stage includes a base, a retaining arm pivotally coupled with the base and having a retaining portion configured to retain at least one probe, and a stepper positioned on the base. In one embodiment of the present disclosure, the stepper is configured in response to an electric signal to move the probe downward through the retaining arm to contact a device under test and to move the probe upward through the retaining arm to separate from the device under test such that the up-and-down movement of the probe can be performed at relatively high frequency of typically greater than six cycles per second.

Abstract: An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width smaller than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuits package.

Abstract: A vertical probe comprises a linear body, a tip portion connected to one side of the linear body, and at least one slot positioned on the linear body. In particular, the vertical probe includes a depressed structure having a plurality of slots positioned on the linear body in parallel and on one side of the linear body. The present application also provides a probe card for integrated circuit devices comprising an upper guiding plate having a plurality of fastening holes, a bottom guiding plate having a plurality of guiding holes and a plurality of vertical probes positioned in the guiding holes. The vertical probe includes a linear body positioned in the guiding holes, a tip portion connected to one side of the linear body and at least one slot positioned on the linear body.