Abstract: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

Abstract: An apparatus is provided for joining together substrates, which have an inner hole, to form a substrate disk. An expandable element is introducible into the inner hole of at least two superimposed substrates. The element is expandable to such an extent that it can come into contact with the inner holes of both of the substrates to close off an intermediate space formed between the substrates relative to the environment. A substrate support is rotatable about an axis of rotation perpendicular to a support surface thereof. A centering device is rotatably coupled with the substrate support and is movable relative thereto in the direction of the axis of rotation. The expandable element is disposed, and is compressible, between the substrate support and the centering device.

Abstract: In order to reduce cycle times for assembling at least two substrates (3,4) in order to form an optical data carrier in a low-pressure chamber (8), a method and a device are disclosed wherein an opening (11) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber (64) is formed between a first handling device (16) arranged in the low-pressure chamber and a second handling device (24) arranged outside the low-pressure chamber by respectively sealing the opening (11) of the low-pressure chamber (8).

Abstract: A method and apparatus for joining at least two substrates together, especially to form an optical data carrier, are provided. Substrates are disposed in a spaced-apart manner between two plates that are disposed opposite from, and are movable relative to, one another. At least one of the plates is connected to a flexible membrane. At least the plate to which the flexible membrane is connected is moved in such a way that a pressure difference is produced on opposite sides of the membrane.

Abstract: To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.

Abstract: An apparatus is provided for joining together at least two substrates, each of which has an inner hole. The apparatus has a pin that is adapted to the inner holes of the substrates. The pin is provided with at least two noses that are movable radially relative to the pin. The noses have linear outer surfaces upon which the edges of the inner holes of the substrates can glide downwardly during movement of the noses toward the pin.

Abstract: To enable filling a pressure tank with a fluid without having to interrupt the use of the pressure tank, a method is provided for filling a pressure tank with a fluid from a refill tank that is disposed higher, whereby the tanks are interconnected via a gas connecting line and a fluid feed line. The method includes the regulation of the pressure in the pressure tank via a proportional valve disposed in a gas inlet line of the pressure tank, while the connecting lines to the refill tank are closed, the adjustment of the pressure in the refill tank to the pressure in the pressure tank, and the opening of the connecting lines between the refill tank and the pressure tank. Furthermore, an apparatus for carrying out the above method is provided.

Abstract: An apparatus for fixing and centering substrates that are each provided with an inner hole is provided. The apparatus has a housing having an axis that extends perpendicular to the plane of a substrate placed on the apparatus. A fixation unit is guided in the housing and is introducible into the inner hole of a substrate. The fixation unit includes an outer element that is moveable along the axis of the housing and relative to the housing, and also includes an inner element that is moveable along the axis of the housing and relative to the housing and to the outer element, which, by way of a relative movement of the inner and outer elements, is expandable for engagement with the inner hole of a substrate.

Abstract: A device and method for thermally treating substrates. A substrate is heated by a heating plate to improve thermal homogeneity. The heating plate is heated using a number of separately controlled heating elements. The temperature of the heating elements is measured and the heating process is controlled by a PID controller. In addition, the temperature of the substrate surface facing away from the heating plate is locally measured. The temperature distribution over the substrate surface is determined according to the measured temperatures and set values for the temperature of the individual heating elements are determined and transmitted to the PID controller.

Abstract: An apparatus and method are provided for handling substrates that are provided with an inner hole. The apparatus includes an inner gripper in the form of an inner hole gripper, and an outer gripper that is embodied as a vacuum gripper and is provided with a ring in which are disposed a plurality of suction devices. A control unit controls the inner and outer grippers such that they are moved relative to one another, while they grasp one and the same substrate, for deforming or bending the substrate. According to the method, a first substrate is grasped by the inner hole gripper, is brought into contact with an outer gripper, and is grasped by the outer gripper. The inner hole gripper is released and moved through the hole in the first substrate and then grasps a second substrate.

Abstract: A plasma sputtering system that may be used to deposit a film on a substrate such as an optical disk is disclosed. In one embodiment, the sputtering system includes a main vacuum chamber. A plurality of sputtering chambers and a load lock chamber are connected to the main vacuum chamber. An assembly of a horizontal unprocessed substrate, an inner mask, and an outer mask are pressed onto a substrate transport tray that is positioned in the load lock. The tray supports the substrate and the masks throughout the processing of the substrate. A vertical lift lowers the tray from the load lock onto a carousel. The carousel transports the tray, substrate and masks to the sputtering chambers and then back to the load lock for unloading. Other lifts raise the tray, processed substrate, and masks from the carousel to the sputtering chambers. The tray is selectively pressed against the lower access aperture of the load lock and sputtering chambers so as to isolated them from the main chamber.

Abstract: A plasma sputtering system is described. A substrate handling system thereof places an unprocessed substrate (e.g., an optical disk), an inner mask, and an outer mask onto a tray in a loadlock of the sputtering system, and then seals the access opening to the loadlock. The substrate and the masks are moved on the tray to a sputtering chamber where the substrate is sputter coated. The substrate handing system removes the processec substrate and accompanying inner and outer masks from the tray in the loadlock to an external substrate change station, where the processed substrate is removed from the masks, which are still gripped by the substrate handling system. Another unprocessed disk is placed on the inner mask and within the outer mask, and the sequence repeats. The substrate handling system only contacts the masks on surfaces thereof that are not subjected to direct sputter deposition.

Abstract: A plasma sputtering system is disclosed, along with methods of sputtering and methods of arranging an array of magnets disposed within the sputtering system. An embodiment of the sputtering system includes a vacuum chamber. A rotating magnetron is disposed in the vacuum chamber. A target is positioned between the magnetron and a substrate upon which material from the target is to be deposited. The magnetron includes an array of pairs of oppositely poled permanent magnets. A closed loop magnetic path extends between the pairs of oppositely poled magnets of the array. The magnetic path includes an inturn region proximate to an axis of rotation of the magnetron and at least two (e.g., five) indent regions.

Abstract: A substrate disk consists of a first and a second substrate connected to one another wherein the first and second substrates have center holes. The first substrate has at least one projection positioned at the circumference of the center hole and projecting from the face of the substrate. In a preferred embodiment an annular projection surrounding the center hole is provided.

Abstract: A device for conveying substrates through a substrate treatment device has a base transport belt defining a transport plane and two lateral transport belts positioned at a first spacing above the base transport belt. The two lateral transport belts are laterally spaced at a second spacing to one another. Each one of the two lateral transport belts defines a lateral transport plane. Each one of the lateral transport planes is positioned at a slant to the transport plane of the base transport belt. The two lateral transport belts and the base transport belt have cutouts for receiving vertically poisoned substrates. At least one of the first spacing and the second spacing is changeable. Also, the slant angle between at least one of the lateral transport planes to the transport plane of the base transport belt is changeable.

Abstract: A device for drying substrate disks by irradiation with ultraviolet light, wherein during the irradiation process a glass plate is resting on the substrate disk, has a lower part on which the substrate disk rests during drying and a liftable and lowerable upper part for lowering a glass plate onto the substrate disk resting on the lower part. The upper part has a glass plate holding device that is lowered below the substrate disk upon lowering of the upper part for placement of the glass plate onto the substrate disk.

Abstract: A device for coating disc-shaped information storage media with a coating medium has a drying station having an UV lamp for drying the applied coating medium. The UV lamp is arc-shaped and has a radius that is greater than a radius of the disc-shaped information storage media.