Abstract: A system and method cure a combination of a top and a bottom substrate with a resin disposed in-between. A cure platform includes a chuck on which the combination rests. A cure device cures the resin. An actuation assembly separates the chuck from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.
Type:
Grant
Filed:
November 21, 2000
Date of Patent:
January 28, 2003
Assignee:
Steag HamaTech, Inc.
Inventors:
Scott R. Parent, Thomas M. Thibault, Donald G. Parent
Abstract: A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.
Type:
Grant
Filed:
February 4, 2000
Date of Patent:
December 31, 2002
Assignee:
STEAG HamaTech, Inc.
Inventors:
Joseph W. Paulus, Kendrick H. Light, Scott R. Parent, Donald G. Parent, Arthur R. LeBlanc, III, Elango Ramanathan, Aziz Calcuttawala, Richard W. Stowe
Abstract: A system and method to maintain concentricity of a center hole of a top substrate and of a bottom substrate in a bonded storage disk manufacturing system. A first device holds a coaxial arrangement of a top and bottom substrate around a first arbor. A second device holding the arrangement in a coaxial arrangement around a second arbor. One of the first and second arbors is fixed to its associated device and the other is movable in response to urging from the one arbor so that the arrangement maintains concentricity.
Type:
Grant
Filed:
June 30, 2000
Date of Patent:
August 13, 2002
Assignee:
Steag HamaTech, Inc.
Inventors:
Joseph W. Paulus, Scott R. Parent, Thomas M. Thibault, Guy P. Laverriere, Donald G. Parent
Abstract: A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.
Type:
Grant
Filed:
September 23, 1999
Date of Patent:
March 12, 2002
Assignee:
STEAG HamaTech, Inc.
Inventors:
Joseph W. Paulus, Kendrick H. Light, Scott R. Parent, Donald G. Parent, Elangovan Ramanatham
Abstract: A system and method cure a resin disposed between a combination of a top substrate and a bottom substrate with low power. One of the top and bottom substrates includes metallized data pits. Resin-curing light is directed at sides of the data pits.
Type:
Grant
Filed:
May 19, 1998
Date of Patent:
March 5, 2002
Assignee:
STEAG HamaTech, Inc.
Inventors:
Joseph W. Paulus, Kendrick H. Light, Scott R. Parent, Donald G. Parent, Arthur R. LeBlanc, III, Elango Ramanathan, Aziz Calcuttawala, Richard W. Stowe
Abstract: An improved substrate and stamper holder and method of forming substrates are disclosed. According to a preferred embodiment of the invention, a substrate for a DVD has a moat with a capillary barrier shape. Under one embodiment, the moat has a region with an abrupt outer diameter transition. One embodiment has the outer diameter transition at approximately at a right angle relative to a registering surface of the substrate. Another embodiment of the invention provides a wider moats. The improvements reduce the likelihood of resin wicking past the moats.
Type:
Grant
Filed:
January 31, 2000
Date of Patent:
December 25, 2001
Assignee:
STEAG HamaTech, Inc.
Inventors:
Joseph W. Paulus, Arthur R. LeBlanc, III
Abstract: A system and method cure a combination of a top and a bottom substrate with a resin disposed in-between. A cure platform includes a chuck on which the combination rests. A cure device cures the resin. An actuation assembly separates the chuck from the platform to thermally isolate the chuck during a curing operation performed by the cure device. A post cooling assembly may be provided to cool the chuck and the combination after a curing operation is performed by the cure device.
Type:
Grant
Filed:
May 19, 1998
Date of Patent:
July 3, 2001
Assignee:
Steag Hamatech, Inc.
Inventors:
Scott R. Parent, Thomas M. Thibault, Donald G. Parent