Abstract: The invention relates to a method for producing electronic components in a vacuum. The aim of the invention is to create flexible electronic components that have an optimum action, are cost-effective, and easy to produce in a single working cycle. To this end, a carrier film (12) is partially and/or selectively compressed with a blocking liquid, and is subjected to cathodic sputtering. A metallic layer is deposited on the carrier film (12) in the region free of the blocking layer, and the blocking liquid is evaporated during the evaporation process. A semiconductor agent is applied to the coated carrier film (12) during another evaporation process, and a coating with acrylate is then carried out. The carrier liquid is then partially and/or selectively reapplied to the acrylate layer and a cathodic sputtering is carried out. The cited coating processes are optionally repeated, and connections can be established between the individual metallized layers.

Abstract: The present invention relates to highly lustrous gold-colored metal effect pigments comprising a copper-based alloy and additional metallic alloy components, preferably aluminum, and which are produced by means of stripping and comminuting metal films deposited in vacuo.

Abstract: A pointed wire-shaped filling material made of aluminium is utilized to contact the point at a position of an aluminium mould to be repaired. The wire-shaped filling material is charged with a current in order to melt the point of the filling material and form an arc which melts the mould at the position of repair. The filling material is then pressed into the mould at the position to be repaired. Upon filling the repair point, the wire-shaped filling material is cut close to the surface of the mould to complete the repairing process.

Abstract: A capacitor of the self-healing type having a metallic coating which is vapor-deposited under vacuum and provided with a plurality of minute apertures therein which are configured as narrow slots rounded at their ends which subdivide the metallic coating into surface elements small in area, and at there ends there are bridges of smaller width which conductingly connect the surface elements.