Abstract: A device for magnifying an object comprising an SSID having at least one imaging array disposed on a distal end thereof. The device further comprises a first optical element disposed on the distal end of the SSID wherein the first optical element has a distal end and a proximal end defining a first longitudinal length. A GRIN lens is disposed on the distal end of the first optical element and a second optical element is disposed on the distal end of the GRIN lens defining a second longitudinal length. The first longitudinal length and the second longitudinal length are configured such that when viewing the object at a predetermined wavelength of light, the object is magnified at a predetermined level of magnification and the focal plane of the magnified object is aligned at the proximal end of the first optical element.

Abstract: A mini-scope for multi-directional imaging is disclosed. The mini-scope includes an elongated mini-scoped body. An emissions aperture is disposed on the distal end of the elongated mini-scope body, which can be configured to emit a beam of optical energy propagating through a flexible optical conductor. A selective mirror is also positioned at the distal end of the elongated mini-scope body and is configured to selectively pass or reflect the beam of optical energy based on the optical characteristics of the beam. A SSID is further disposed on the distal end of the elongated mini-scope body for imaging illumination reflected by an external object in response to the beam of optical energy. This illumination is directed to pass through or reflect from the selective mirror to the camera based on optical characteristics of the beam.

Abstract: The present invention is drawn toward miniaturized imaging devices. In one embodiment, the device can include a utility guide having at least one aperture configured for supporting utilities, and an SSID carried by the utility guide. The SSID can include an imaging array on a top surface, and a conductive element on a side surface, wherein the imaging array is electrically coupled to the conductive element. Further, a lens can be optically coupled to the imaging array, and an umbilical, including a conductive line, can be carried by the at least one aperture. The conductive line can be electrically coupled to the conductive element on the side surface of the SSID. Alternatively, the device can include an SSID having, as an integral structure, an imaging array electrically coupled to a conductive pad, wherein the SSID further includes at least one utility aperture passing therethrough.

Abstract: A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.

Abstract: A miniaturized imaging device and method of viewing small luminal cavities are described. The imaging device can be used as part of a catheter, and can include a lens, an SSID including an imaging array optically coupled to the lens; an umbilical including a conductive line; and an adaptor configured to support the lens and provide electrical communication between the SSID and conductive line. Alternatively, the adaptor can be a rigid adaptor configured to provide electrical communication between the SSID and the conductive line through a conductive path. The conductive path can be configured along multiple contiguous surfaces of the adaptor such that the SSID is electrically coupled to the conductive path at a first surface, and the conductive line is electrically coupled to the conductive path at a second surface.