Abstract: A method for producing thin conductive or semiconductive layers embedded in silicon in the manufacture of structures for integrated circuits and the like. The invention is characterized by implanting metal atoms (14) in a silicon substrate (15) to a pre-determined nominal depth, and subsequently causing the implanted metal atoms to be redistributed, to form a conductive or a semiconductive layer (16), by heat-treating the silicon substrate (15).
Type:
Grant
Filed:
July 30, 1987
Date of Patent:
June 6, 1989
Assignee:
Stiftelsen Institutet for Microvagsteknik VID