Patents Assigned to STMicoroelectronics S.r.l.
  • Packaged device exposed to environmental air and liquids and manufacturing method thereof
    Patent number: 9011776
    Abstract: A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: April 21, 2015
    Assignee: STMicoroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Fulvio Vittorio Fontana, Luca Maggi