Patents Assigned to STMicroelectronic, Inc.
  • Patent number: 10541196
    Abstract: The present disclosure is directed to a leadframe package having solder wettable sidewalls that is formed using a pre-molded leadframe and methods of manufacturing the same. A metal plated leadframe with a plurality of recesses and a plurality of apertures is placed into a top and bottom mold tool. A molding compound is then formed in the plurality of recesses and apertures in the leadframe to form a pre-molded leadframe. A plurality of die and wires are coupled to the pre-molded leadframe and the resulting combination is covered in an encapsulant. Alternatively, a bare leadframe can be processed and the metal layer can be applied after encapsulation. A saw or other cutting means is used for singulation to form leadframe packages. Each resulting leadframe package has a solder wettable sidewall for improving the strength of solder joints between the package and a circuit board.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: January 21, 2020
    Assignee: STMicroelectronics, Inc.
    Inventors: Aaron Cadag, Ernesto Antilano, Jr., Ela Mia Cadag
  • Patent number: 10535588
    Abstract: The present disclosure is directed to a die having a metallized sidewall and methods of manufacturing the same. A contiguous metal layer is applied to each edge of a backside of a wafer. The wafer is cut at a base of a plurality of channels formed in the backside to create individual die each having a flange that is part of a sidewall of the die and includes a portion that is covered by the metal layer. When an individual die is coupled to a die pad, a semiconductive glue bonds the metal layer on the sidewall and a backside of the die to the die pad, which decreases the risk of delamination along the sides of the die. The flange also prevents the glue from contacting the active side of the die by acting as a barrier against adhesive creep of the glue up the sidewall of the die.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: January 14, 2020
    Assignee: STMicroelectronics, Inc.
    Inventors: Rennier Rodriguez, Aiza Marie Agudon, Jefferson Talledo
  • Patent number: 10531132
    Abstract: A channel stream is received and demultiplexed into a video packetized elementary stream (PES), audio packetized elementary stream (PES), and program clock reference (PCR). Indexing circuitry stores the video PES and the audio PES in a buffer, locates a presentation time stamp (PTS) in the video PES and stores that PTS in the buffer, locates a start of each group of pictures (GOP) in the video PES and stores those locations in the buffer, and locates a PTS in the audio PES and stores that PTS in the buffer. Control circuitry empties the buffer of an oldest GOP in the video PES if the PCR is greater than the PTS of a second oldest GOP stored in the buffer, and empties the buffer of each PES packet of the audio PES that has a PTS that is less than the PTS of the oldest GOP stored.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: January 7, 2020
    Assignees: STMicroelectronics International N.V., STMicroelectronics, Inc.
    Inventors: Udit Kumar, Bharat Jauhari, Chandandeep Singh Pabla
  • Patent number: 10527867
    Abstract: Various embodiments provide an optical image stabilization circuit including a drive circuit having a power waveform generator and a power waveform conversion circuit. The power waveform generator generates a power waveform. The power waveform conversion circuit converts the power waveform to a power drive signal. An actuator is then driven by the power drive signal to move a lens accordingly and compensate for any movements and vibrations of a housing of the lens.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: January 7, 2020
    Assignee: STMicroelectronics, Inc.
    Inventors: Mark A. Lysinger, Chih-Hung Tai, James L. Worley, Pavan Nallamothu
  • Patent number: 10520552
    Abstract: An electronic device includes a processor coupled to a battery and to determine whether the battery is being charged or discharged. If the battery being is being discharged, the processor operates to calculate an amount by which the battery has discharged since a preceding calculation of remaining capacity of the battery, compensate the amount by which the battery has discharged for a condition of the battery, and calculate a remaining capacity of the battery as a function of the amount by which the battery has discharged. If the battery is being charged, the processor operates to calculate an amount by which the battery has charged since a preceding calculation of remaining capacity of the battery, compensate the amount by which the battery has charged for a condition of the battery, and calculate the remaining capacity of the battery as a function of the amount by which the battery has charged.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: December 31, 2019
    Assignees: STMicroelectronics, Inc., STMicroelectronics International N.V.
    Inventors: K. R. Hariharasudhan, Frank J. Sigmund
  • Patent number: 10520748
    Abstract: Various embodiments provide an optical image stabilization circuit including a drive circuit having a power waveform generator and a power waveform conversion circuit. The power waveform generator generates a power waveform. The power waveform conversion circuit converts the power waveform to a power drive signal. An actuator is then driven by the power drive signal to move a lens accordingly and compensate for any movements and vibrations of a housing of the lens.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: December 31, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Mark A. Lysinger, Chih-Hung Tai, James L. Worley, Pavan Nallamothu
  • Patent number: 10504031
    Abstract: An electronic device described herein includes a sensing unit having at least one sensor to acquire sensing data. An associated computing device extracts sensor specific features from the sensing data, and generates a motion activity vector, a voice activity vector, and a spatial environment vector as a function of the sensor specific features. The motion activity vector, voice activity vector, and spatial environment vector are processed to determine a base level context of the electronic device relative to its surroundings, with the base level context having aspects each based on the motion activity vector, voice activity vector, and spatial environment vector. Meta level context of the electronic device relative to its surroundings is determined as a function of the base level context, with the meta level context being at least one inference made from at least two aspects of the plurality of aspects of the base level context.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: December 10, 2019
    Assignees: STMicroelectronics International N.V., STMicroelectronics, Inc.
    Inventors: Mahesh Chowdhary, Arun Kumar, Ghanapriya Singh, Kashif R. J. Meer, Indra Narayan Kar, Rajendar Bahl
  • Patent number: 10505254
    Abstract: A near field communications (NFC) transponder includes a transmit circuit coupled to a transmit antenna and a receive circuit coupled to a receive antenna. The transmit/receive antennae are configured such that no signal is induced on the receive antenna by operation of the transmit antenna. Advantageously, this permits continued reception by the receive antenna while the transmit antenna is used for transmission using active load modulation.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: December 10, 2019
    Assignee: STMicroelectronics, Inc.
    Inventor: Mohammad Mazooji
  • Patent number: 10501313
    Abstract: The present disclosure is directed to a microfluidic die that includes ejection circuitry and one time programmable memory with a minimal number of contact pads to external devices. The die includes a relatively large number of nozzles and a relatively small number of contact pads. The die includes decoding circuitry that utilizes the small number of contact pads to control the drive and ejection of the nozzles and the reading/writing of the memory with the same contact pads.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: December 10, 2019
    Assignees: STMicroelectronics Asia Pacific Pte Ltd, STMicroelectronics S.r.l., STMicroelectronics, Inc.
    Inventors: Teck Khim Neo, Mauro Pasetti, Franco Consiglieri, Luca Molinari, Andrea Nicola Colecchia, Simon Dodd
  • Patent number: 10480941
    Abstract: A sensor chip is mounted on a PCB and electrically connected to a SOC mounted on the PCB via at least one conductive trace. The sensor chip includes configuration registers storing and outputting configuration data, and a PLD receiving digital data. The PLD performs an extraction of features of the digital data in accordance with the configuration data, and the configuration data includes changeable parameters of the extraction. A classification unit processes the extracted features of the digital data so as to generate a context of an electronic device into which the sensor chip is incorporated relative to its surroundings, the processing being performed in using a processing technique operating in accordance with the configuration data. The configuration data also includes changeable parameters of the processing technique. The classification unit outputs the context to data registers for storage.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: November 19, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Mahesh Chowdhary, Sankalp Dayal
  • Patent number: 10483393
    Abstract: Methods and structures for forming strained-channel finFETs are described. Fin structures for finFETs may be formed in two epitaxial layers that are grown over a bulk substrate. A first thin epitaxial layer may be cut and used to impart strain to an adjacent channel region of the finFET via elastic relaxation. The structures exhibit a preferred design range for increasing induced strain and uniformity of the strain over the fin height.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: November 19, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Nicolas Loubet, Pierre Morin
  • Patent number: 10473691
    Abstract: The present disclosure is directed to a system that includes a sensor and a signal conditioner coupled to the sensor. The signal conditioner includes signal processing circuitry coupled to the sensor and offset cancellation circuitry. The offset cancellation circuitry includes a sign detector configured to output a high signal or a low signal based on a sign of an output signal from the signal processing circuitry, an integrator coupled to the sign detector, and a divider coupled to the integrator and to an input of the signal processing circuitry.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: November 12, 2019
    Assignee: STMicroelectronics, Inc.
    Inventor: Fabio Romano
  • Patent number: 10466503
    Abstract: Various embodiments provide an optical image stabilization circuit that synchronizes its gyroscope and drive circuit using gyroscope data ready signals and gyroscope reset signals. In response to a gyroscope data ready signal, the optical image stabilization circuit synchronously obtains position measurements of a camera lens when power drive signals are not transitioning from one power level to another power level, and synchronously transitions the power drive signals simultaneously with gyroscope reset signals. By synchronizing the gyroscope and the drive circuit, the gyroscope and other onboard sensing circuits are isolated from noise generated by the drive circuit.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: November 5, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Chih-Hung Tai, Felix Kim, Mark A. Lysinger
  • Patent number: 10459537
    Abstract: An encapsulated pressure sensor includes a pressure sensor having a pressure sensing surface and a mounting surface. The mounting surface is attached to a mounting substrate. A fluid contacts the pressure sensing surface of the pressure sensor. A deformable encapsulating member is attached to the mounting substrate and encapsulates the pressure sensor and the fluid.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: October 29, 2019
    Assignee: STMicroelectronics, Inc.
    Inventor: Dominique Paul Barbier
  • Patent number: 10459243
    Abstract: Various embodiments provide an optical image stabilization circuit that synchronizes its gyroscope and drive circuit using gyroscope data ready signals and gyroscope reset signals. In response to a gyroscope data ready signal, the optical image stabilization circuit synchronously obtains position measurements of a camera lens when power drive signals are not transitioning from one power level to another power level, and synchronously transitions the power drive signals simultaneously with gyroscope reset signals. By synchronizing the gyroscope and the drive circuit, the gyroscope and other onboard sensing circuits are isolated from noise generated by the drive circuit.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: October 29, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Chih-Hung Tai, Felix Kim, Mark A. Lysinger
  • Patent number: 10461948
    Abstract: A powerline communications apparatus includes a transceiver communicating over an electrical power distribution wiring of a vehicle and a communications interface carrying a first and second PLC message in a first communication protocol having a PLC automotive network delimiter type, a PLCAN variant field comprising a number of users, user identifications, payload length, payload data, and a repetition number corresponding to a number of times the first PLC message is transmitted over the electrical power distribution wiring, and a first payload for a first user. The PLC apparatus also includes a processor and a non-transitory computer-readable medium storing programming for execution by the processor. The programming includes instructions for transmitting the first PLC message using the transceiver, determining if the vehicle is in motion, and switching between the first and the second communication protocol based on whether the vehicle is determined to be in motion.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: October 29, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Oleg Logvinov, Bo Zhang, Huijuan Liu, Michael John Macaluso, James D. Allen
  • Patent number: 10434252
    Abstract: A flow rate sensor is provided in a wireless, leadless package. The flow rate sensor includes a MEMs sensor coupled to an ASIC and an antenna. The flow rate sensor is powered by radiation received from a control module adjacent the flow rate sensor. The flow rate sensor is placed within a fluid and monitors the flow rate of the fluid. The control module is not in the fluid and receives flow rate data from the flow rate sensor.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: October 8, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Nicholas Trombly, Patrick Furlan
  • Patent number: 10420140
    Abstract: Multicast transmissions are efficient but do not allow for individual acknowledgement that the data was received by each receiver. This is not acceptable for isochronous systems that require specific levels of QoS for each device. A multimedia communications protocol is provided that uses a novel multi-destination burst transmission protocol in multimedia isochronous systems. The transmitter establishes a bi-directional burst mode for multicasting data to multiple devices and receiving Reverse Start of Frame (RSOF) delimiters from each multicast-destination receiver in response to multiple SOF delimiters, thus providing protocol-efficient multi-destination acknowledgements.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: September 17, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Oleg Logvinov, Aidan Cully, David Lawrence, Michael J. Macaluso
  • Patent number: 10418488
    Abstract: Methods and structures for forming strained-channel FETs are described. A strain-inducing layer may be formed under stress in a silicon-on-insulator substrate below the insulator. Stress-relief cuts may be formed in the strain-inducing layer to relieve stress in the strain-inducing layer. The relief of stress can impart strain to an adjacent semiconductor layer. Strained-channel, fully-depleted SOI FETs and strained-channel finFETs may be formed from the adjacent semiconductor layer. The amount and type of strain may be controlled by etch depths and geometries of the stress-relief cuts and choice of materials for the strain-inducing layer.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: September 17, 2019
    Assignee: STMicroelectronics, Inc.
    Inventor: Pierre Morin
  • Patent number: 10411140
    Abstract: An integrated transistor in the form of a nanoscale electromechanical switch eliminates CMOS current leakage and increases switching speed. The nanoscale electromechanical switch features a semiconducting cantilever that extends from a portion of the substrate into a cavity. The cantilever flexes in response to a voltage applied to the transistor gate thus forming a conducting channel underneath the gate. When the device is off, the cantilever returns to its resting position. Such motion of the cantilever breaks the circuit, restoring a void underneath the gate that blocks current flow, thus solving the problem of leakage. Fabrication of the nano-electromechanical switch is compatible with existing CMOS transistor fabrication processes. By doping the cantilever and using a back bias and a metallic cantilever tip, sensitivity of the switch can be further improved. A footprint of the nano-electromechanical switch can be as small as 0.1×0.1 ?m2.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: September 10, 2019
    Assignee: STMicroelectronics, Inc.
    Inventors: Qing Liu, John H. Zhang