Abstract: An integrated circuit improves scan testing efficiency by addressing slow Scan-OUT pins. The integrated circuit shifts data through high-frequency Scan-OUT pins every cycle and through low-frequency Scan-OUT pins every other cycle. Data that cannot be shifted through low-frequency pins is stored in an accumulator and later shifted out through high-frequency pins. Despite changing the scan-out data pattern, the tester used for testing the integrated circuit anticipates the resulting pattern, providing for the testing to not be negatively impacted.

Abstract: An integrated circuit includes a memory array and a memory read circuitry for reading data from the memory array. The memory read circuitry includes a leakage current compensation circuit. The leakage current compensation circuit senses the leakage current in a bitline of the memory array during a read operation and generates a leakage compensation current to offset the leakage current during the read operation.

Abstract: A startup circuit includes a first circuit leg coupled between an input node and an output node and a second circuit leg coupled between the input node and the output node. The first circuit generates a first current and the second circuit leg sinks current from a first node based upon the first current. A third circuit leg is coupled between the input node and the output node and sources current to a second node based upon a voltage at the first node to thereby generate a feedback voltage at the second node. The first circuit leg increases the first current based upon the feedback voltage, in turn increasing the current sunk from the first node by the second circuit leg and increasing the current sourced to the second node by the third circuit leg to thereby generate a startup current at the output node.

Abstract: An LDO regulator has a pass device arranged between an input node and an output node. The pass device is controlled at a control node by an error amplifier. A first current generator sources compensation current to the control node, a cascode device is arranged between the control node and a compensation node, and a second current generator sinks compensation current from the compensation node. A compensation capacitor is arranged between the output and compensation nodes. Load current through the pass device is sensed to generate a feedback current at a first feedback node. An input branch of a current mirror receives the feedback current. A filtering circuit is coupled between a control terminal of the input branch and a second feedback node. Output branches of the current mirror sink and source additional compensation current from the compensation node and the control node, respectively, proportional to the feedback current.

Abstract: According to an embodiment, a method for testing and repairing local memory in a hardware accelerator from a one-time programmable memory (OTP) is provided. The method includes asserting a grant signal, a loading of a first repair data for a sub-set of the local memory associated with a main-controller from a first partition of the OTP memory, communicating a status signal after completion of the loading indicating a completion of the loading, and de-asserting the grant signal in response to receiving the status signal.

Abstract: Circuits and methods for testing voltage monitor circuits are provided. In one embodiment, a method includes setting voltage monitor circuits to test mode; setting, a monitor reference in each voltage monitor circuit, to a respective targeted threshold voltage using a corresponding trim code; ramping, a voltage provided to a subset of voltage monitor circuits, from a first voltage to a second voltage using a test voltage supply, voltages between the first voltage and the second voltage corresponding with targeted threshold voltages of the subset of voltage monitor circuits; determining, for each voltage monitor circuit in the subset of voltage monitor circuits, a voltage value of the test voltage supply resulting in a change in a logic state at an output of a corresponding voltage monitor circuit.

Abstract: A method for accessing memory cells in an array of memory cells storing respective data signals, wherein memory cells in the array of memory cells have a first, resp. second, node selectively couplable to respective bitline branches in a first, resp. second, set of bitline branches, wherein the first and the second set of bitline branches provide at least one bitline capacitance configured to store a bias level of charge in response to being charged.

Abstract: An integrated circuit improves scan testing efficiency by addressing slow Scan-OUT pins. The integrated circuit shifts data through high-frequency Scan-OUT pins every cycle and through low-frequency Scan-OUT pins every other cycle. Data that cannot be shifted through low-frequency pins is stored in an accumulator and later shifted out through high-frequency pins. Despite changing the scan-out data pattern, the tester used for testing the integrated circuit anticipates the resulting pattern, providing for the testing to not be negatively impacted.

Abstract: An HEMT includes: a heterostructure; a dielectric layer on the heterostructure; a gate electrode, which extends throughout the thickness of the dielectric layer; a source electrode; and a drain electrode. The dielectric layer extends between the gate electrode and the drain electrode and is absent between the gate electrode and the source electrode. In this way, the distance between the gate electrode and the source electrode can be designed in the absence of constraints due to a field plate that extends towards the source electrode.

Abstract: A pixel includes, on a first face, first trenches extending parallel to a first direction and regularly spaced in a second direction (orthogonal to the first direction) and second trenches extending parallel to the second direction and regularly spaced in the first direction. The first trenches include first notches, each first notch extending from a first trench and being aligned with a corresponding second trench. The second trenches include second notches, each second notch extending from a second trench and being aligned with a corresponding first trench.

Abstract: Provided is an integrated circuit that includes: a terminal designed to receive a signal at a rated voltage level which can rise to a maximum voltage level; an output circuit including a first transistor and a second transistor coupled in series between the terminal and an output stage; and a protection circuit designed to generate a first voltage controlling the first transistor, and a second voltage controlling the second transistor. In an activated state, the first voltage and the second voltage are obtained by dividing the voltage level of said terminal. In a deactivated state, the first voltage is obtained by the voltage level of said terminal, and the second voltage is obtained by the level of a control voltage minus a threshold voltage of a protection transistor.

Abstract: A method for manufacturing a SiC-based electronic device, that includes implanting, at a front side of a solid body of SiC having a conductivity of N type, dopant species of P type, thus forming an implanted region that extends in depth in the solid body starting from the front side and has a top surface co-planar with said front side; and generating a laser beam directed towards the implanted region in order to generate heating of the implanted region at temperatures comprised between 1500° C. and 2600° C. so as to form an ohmic contact region including one or more carbon-rich layers, for example graphene and/or graphite layers, in the implanted region and, simultaneously, activation of the dopant species of P type.

Abstract: A power stage includes parallel FETs including a reference FET. An input PWM signal has a switching period. A current sensor senses current flowing through the power stage during switch-on period. A first circuit generates a first PWM signal having a duty-cycle indicative of reference FET driving losses for a reference current. A second circuit generates a second PWM signal having a duty-cycle indicative of reference FET conduction losses for that reference current. The duty cycles of the first and second PWM signals are compared to generate a comparison signal. The reference current is changed until a logic state of the comparison signal changes. A respective enable signal for each FET is generated by comparing the reference current to the sensed current flowing through the power stage. A FET driver circuit generates a respective drive signal for each FET by combining the respective enable signal with the input PWM signal.

Abstract: A Phase Change Memory (PCM) device includes sets of cells in which a binary logic level is written by a write operation. Each cell is included in a respective set of cells in the sets of cells. The write operation includes: performing write verify operations on the cells to identify an actual logic level stored in the cells; checking if the identified actual logic level matches a certain the binary logic level; in response to the checking determining that in at least one cell the actual logic level fails to match the binary logic level, correcting the actual logic level to match the binary logic level by performing: a set write operation in case the binary logic level is a high logic level, or a reset write operation in case the binary logic level is a low logic level.

Abstract: A power conversion circuit includes a first node configured to receive a first voltage referenced to a second node configured to be coupled to a reference potential. A first power converter couples the first node to a third node. A second power converter couples a fourth node to an output node. A first capacitor couples the third node to the fourth node. A first switch connects the output node to the first node. An output switch connects the output node to a load.

Abstract: Micromachined ultrasonic transducer wherein a die including semiconductor material accommodates at least one ultrasonic cell. Each ultrasonic cell includes a piezoelectric structure, a cavity, and a membrane region, vertically aligned with each other. The cavity extends inside the die and downwardly delimits the membrane region. The piezoelectric structure is arranged on the membrane region and has at least one annular-shaped piezoelectric region. The micromachined ultrasonic transducer is configured to operate around the second axisymmetric vibration mode.

Abstract: In an embodiment, a voltage converter is configured to operate by a succession of operating cycles, each cycle comprising an energy accumulation phase and an energy restitution phase, wherein the converter is further configured to determine a duration of one of the phases by comparing a voltage ramp and a first reference voltage, and wherein a slope of the voltage ramp depends on a sign of a current in an inductor at an end of a previous operating cycle.

Abstract: A PMUT device includes a membrane element adapted to generate and receive ultrasonic waves by oscillating, about an equilibrium position, at a corresponding resonance frequency. A piezoelectric element is located over the membrane element along a first direction and configured to cause the membrane element to oscillate when electric signals are applied to the piezoelectric element, and generate electric signals in response to oscillations of the membrane element. A damper is configured to reduce free oscillations of the membrane element, and the damper includes a damper cavity surrounding the membrane element, and a polymeric member having at least a portion over the damper cavity along the first direction.

Abstract: Trenches of different depths in an integrated circuit are formed by a process utilizes a dry etch. A first stop layer is formed over first and second zones of the substrate. A second stop layer is formed over the first stop layer in only the second zone. A patterned mask defines the locations where the trenches are to be formed. The dry etch uses the mask to etch in the first zone, in a given time, through the first stop layer and then into the substrate down to a first depth to form a first trench. This etch also, at the same time, etch in the second zone through the second stop layer, and further through the first stop layer, and then into the substrate down to a second depth to form a second trench. The second depth is shallower than the first depth.

Abstract: Image sensors and methods of manufacturing image sensors are provided. One such method includes forming a structure that includes a semiconductor layer extending from a front side to a back side, and a capacitive insulation wall extending through the semiconductor layer. The capacitive insulation wall includes first and second insulating walls separated by a region of a conductor or a semiconductor material. Portions of the semiconductor layer and the region of the conductor or semiconductor material are selectively etched, and the first and second insulating walls have portions protruding outwardly beyond a back side of the semiconductor layer and of the region of the conductor or semiconductor material. A dielectric passivation layer is deposited on the back side of the structure, and portions of the dielectric passivation layer are locally removed on a back side of the protruding portions of the first and second insulating walls.