Abstract: The method for controlling an angular position of a MEMS mirror, includes: applying a first driving moment to the MEMS mirror to generate a rotational scanning movement of the mirror; and, at a zooming instant, applying a second driving moment to the MEMS mirror, wherein the second driving moment is equal to the first driving moment plus an extra moment. The extra moment may be a DC offset. After a transient period of time from zooming instant, a third driving moment M2=k{dot over (?)}2t is applied. The first and third driving moment are variable linearly with time. The driving moments are applied to torsional springs of the mirror.

Abstract: Embodiments are directed to power conversion circuits including a bypass circuit for bypassing an inrush current limiting resistor. In one embodiment, a power conversion circuit is provided that includes a bridge rectifier, a current limiting resistor, a controllable current switching device, and a driver. The current limiting resistor has a first terminal coupled to an output terminal of the bridge rectifier and a second terminal coupled to an electrical ground. The controllable current switching device has conduction terminals coupled in parallel with respect to the current limiting resistor. The driver is coupled between the first terminal of the current limiting resistor and a control terminal of the current switching device, and the driver controls an operation of the current switching device based on a current through the current limiting resistor.

Abstract: An embodiment is a circuit for use with a display device, the circuit including: a first input node configured to be operatively coupled to a first port of a data source device that provides the display device with data, to receive a first direct voltage used for a real-time display of the data on the display device; and at least one output node, configured to operatively provide the display device with at least one output voltage generated based on the first direct voltage, wherein the first port is isolated from a data port used to transmit the data.

Abstract: A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract: A method for testing a strip of MEMS devices, the MEMS devices including at least a respective die of semiconductor material coupled to an internal surface of a common substrate and covered by a protection material; the method envisages: detecting electrical values generated by the MEMS devices in response to at least a testing stimulus; and, before the step of detecting, at least partially separating contiguous MEMS devices in the strip. The step of separating includes defining a separation trench between the contiguous MEMS devices, the separation trench extending through the whole thickness of the protection material and through a surface portion of the substrate, starting from the internal surface of the substrate.

Abstract: A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.

Abstract: An embodiment is a circuit for use with a display device, the circuit including: a first input node configured to be operatively coupled to a first port of a data source device that provides the display device with data, to receive a first direct voltage used for a real-time display of the data on the display device; and at least one output node, configured to operatively provide the display device with at least one output voltage generated based on the first direct voltage, wherein the first port is isolated from a data port used to transmit the data.

Abstract: A WLAN communication system and algorithm that adaptively changes the data transmission rate of a communication channel based on changing channel conditions. The WLAN communication system or algorithm has two modes being a searching mode and a transmission mode. Furthermore, the WLAN communication system or algorithm incorporates an additive increase, multiplicative decrease (AIMD) function into the rate adaptation algorithm.

Abstract: Pins on an RFIC package carry RF signals between the package and a PCB. A first capacitor is coupled between a selected pin of the RFIC package near the pins carrying the RF signals and a radio-frequency ground on the PCB. A coupling between the RFIC package and the PCB is modeled, and includes modeling of the pins of interest and at least one parasitic element of the coupling. A capacitance of the first capacitor is selected based on the modeling to obtain desired performance at selected operational frequencies. A second capacitor may be coupled between the selected pin a radio frequency ground of the RFIC package. An inductor may be coupled in parallel across the first capacitor.

Abstract: Methods and device for in-system firmware update in an information output device are provided. In one aspect, a method of firmware update in a display device receives a set of data in an image format through a video signal input channel of an input port of the display device. The set of data is converted from the image format to an instruction set format that is different from the image format. A first set of instructions that is used to operate the display device is updated with the set of data in the instruction set format.

Abstract: A removable wafer expander for die bonding equipment for a singularized wafer supported by a flexible sticky substrate, the removable wafer expander provided with a first ring member to be coupled with a second ring member for remote expansion of the flexible sticky substrate therebetween before the mounting of the wafer expander onto the die bonding equipment.

Abstract: An interpolation filter for interpolating a digital signal includes a cascade of template filters, each having an identical template transfer function A(z), which is arranged to receive and filter an input sequence representing the digital signal sampled at an input sampling rate. Ancillary circuitry is coupled to the cascade so as to produce first and second phase outputs. A multiplexer is arranged to multiplex the phase outputs in order to generate an output sequence having an output sampling rate equal to twice the input sampling rate.

Abstract: Methods and systems provide an efficient power save mode for multi carrier modems, such as DMT based ADSL and VDSL modems. Fast transitions from power save mode to full operational mode occur, without the overhead of transmitting large quantities of configuration information between the transmitter and receiver. Signal constellation size changes occurring while operating in power save mode to continue to apply once full operational mode is resumed. Multiple power save modes are enabled, each having a different level of power dissipation and crosstalk, both far end crosstalk and near end crosstalk. Power dissipation and crosstalk can thus be graduated on a line, according to a user-requested bit rate.

Abstract: Digital data is transmitted in a block-based hyperframe that consists of N frames. Each frame carries multiplexed data from one or more user data channels and a control channel. Control channel information is unequally allocated among the N frames, the amount of information carried in each frame varying according to the frame's position in the hyperframe. All of the user data channels except one carry a predetermined number of transmission units in each frame. The excepted user data channel carries a calculated amount needed to round out the particular frame. Following multiplexing, a block encoder defines the frames and adds error detection or error correction information. The number of frames per hyperframe and the total number of transmission units for the control channel are available to a receiver, which can then demultiplex the hyperframe.

Abstract: A method for digital communication includes generating time-domain symbols having a predetermined symbol duration in accordance with a discrete multi-tone (DMT) modulation scheme. A cyclic extension is added to each of the time-domain symbols so as to form data blocks having a block length that is not an integer multiple of the symbol duration. A training pattern is generated on one or more tones of the DMT modulation scheme, wherein the training pattern is periodic over a sequence of the data blocks with a period equal to the symbol duration. The sequence of the data blocks is transmitted over a communication channel to a receiver, which processes the training pattern so as to determine a response of the channel to the one or more tones.

Abstract: A method for data communication includes providing an order for assigning bits of an input data stream to tones in a multi-tone modulation scheme, and allocating respective bit-loading values to the tones, such that some of the tones are allocated a first bit-loading value and other tones are allocated at least one second bit-loading value. The order is modified so as to form pairs of the tones that are allocated the first bit-loading value, with one or more of the other tones intervening between at least some of the pairs. The input data stream is modulated by assigning the bits to the tones in accordance with the modified order and the respective bit-loading values, and encoding the bits that are assigned to each of the pairs of the tones as a constellation point.

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract: A chip includes CPU (12), memories (13,14) for programs and data, peripheral units (18,19) for interacting with the outside world, and an internal RC oscillator (17) for providing clock signals. One of the peripheral units (18) includes a timer counter incremented at a frequency derived from the RC oscillator. The method does not try to change the frequency of the RC oscillator. Instead, an external calibration source (21) is connected to a capture input of the timer unit to provide a signal having a reference frequency, e.g. the mains frequency. The counter is sampled on active edges of that signal, and the sampled values are processed to derive a calibration ratio. After these calibration steps, a software correction is applied to parameters handled by programs stored in memory based on the calibration ratio to compensate for frequency variations of the RC oscillator.