Patents Assigned to STMicroelectronics R&D Limited
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Patent number: 10115842Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.Type: GrantFiled: November 2, 2017Date of Patent: October 30, 2018Assignees: STMICROELECTRONICS PTE LTD., STMICROELECTRONICS R&D LIMITEDInventors: Yonggang Jin, David Lawson, Colin Campbell, Anandan Ramasamy
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Patent number: 9831357Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.Type: GrantFiled: May 31, 2013Date of Patent: November 28, 2017Assignees: STMICROELECTRONICS PTE LTD., STMICROELECTRONICS R&D LIMITEDInventors: Yonggang Jin, David Lawson, Colin Campbell, Anandan Ramasamy
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Patent number: 8858885Abstract: The disclosure relates to a pixel-type biological analysis device comprising a photosensitive layer, a capture mixture for the capture of targeted proteins, the capture mixture being placed on an external surface of the photosensitive layer and comprising a protein probe grafted to a hydrogel, collection means for collecting photoelectrons in the photosensitive layer, and reading and treatment means of an electrical quantity supplied by the collection means, for the supply of a characteristic value of a luminous intensity detected by the photosensitive layer.Type: GrantFiled: December 16, 2010Date of Patent: October 14, 2014Assignees: STMicroelectronics (R&D) Limited, Universite Paul Cezanne Aix Marseille IIIInventors: Jeffrey M. Raynor, Michael Maurin, Mitchell O'Neal Perley, Pierre-Francois Lenne, Hervé Rigneault, Renaud Vincentelli
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Publication number: 20130307775Abstract: A system includes two or more optical sensors configured to generate image data based on gestures made by a user. One or more processing devices identifies movement quadrants based on the generated image data. If a match of the identified movement quadrants to one of a set of gesture commands is detected, one or more control signals associated with the matching gesture command are generated.Type: ApplicationFiled: May 15, 2013Publication date: November 21, 2013Applicant: STMicroelectronics R&D LimitedInventor: Jeffrey M. Raynor
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Patent number: 8468381Abstract: A package includes a first die and a second die. The dies are connected to each other through an interface. The interface is configured to transport both control signals and memory transactions. A synchronizer is provided on at least one of said first and second of said dies. The synchronizer is configured to cause any untransmitted control signal values to be transmitted across the interface.Type: GrantFiled: December 2, 2010Date of Patent: June 18, 2013Assignee: STMicroelectronics (R&D) LimitedInventors: Andrew Michael Jones, Stuart Ryan
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Publication number: 20130145176Abstract: A method distributes personalized circuits to one or more parties. The method distributes a generic circuit to each party, encrypts a unique personalization value using a secret encryption key, and transmits each encrypted personalization value to the corresponding party. Each party then stores the encrypted personalization value in their circuit. The stored encrypted personalization value allows a piece of software to be properly executed by the circuit. A semiconductor integrated circuit is arranged to execute a piece of software that inputs a personalization value as an input parameter. The circuit comprises a personalization memory arranged to store an encrypted personalization value; a key memory for storing a decryption key; a control unit comprising a cryptographic circuit arranged to decrypt the encrypted personalization value using the decryption key; and a processor arranged to receive the decrypted personalization value and execute the software using the decrypted personalization value.Type: ApplicationFiled: January 25, 2013Publication date: June 6, 2013Applicant: STMICROELECTRONICS R&D LIMITEDInventor: STMicroelectronics R&D Limited
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Patent number: 8440470Abstract: The disclosure relates to a fabrication process of a biosensor on a semiconductor wafer, comprising steps of: making a central photosensitive zone comprising at least one pixel-type biological analysis device comprising a photosensitive layer, and a first peripheral zone surrounding the central photosensitive zone, comprising electronic circuits. The first peripheral zone is covered by a hydrophilic coating, and the central photosensitive zone is covered with a hydrophobic coating. A barrier of a bio-compatible resin is formed on the second peripheral zone.Type: GrantFiled: December 16, 2010Date of Patent: May 14, 2013Assignees: STMicroelectronics (R&D) Limited, Universite Paul Cezanne Aix Marseille IIIInventors: Jeffrey M. Raynor, Michaël Maurin, Mitchel O'Neal Perley, Pierre-Francois Lenne, Herve Rigneault, Renaud Vincentelli
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Patent number: 8384412Abstract: A method distributes personalized circuits to one or more parties. The method distributes a generic circuit to each party, encrypts a unique personalization value using a secret encryption key, and transmits each encrypted personalization value to the corresponding party. Each party then stores the encrypted personalization value in their circuit. The stored encrypted personalization value allows a piece of software to be properly executed by the circuit. A semiconductor integrated circuit is arranged to execute a piece of software that inputs a personalization value as an input parameter. The circuit comprises a personalization memory arranged to store an encrypted personalization value; a key memory for storing a decryption key; a control unit comprising a cryptographic circuit arranged to decrypt the encrypted personalization value using the decryption key; and a processor arranged to receive the decrypted personalization value and execute the software using the decrypted personalization value.Type: GrantFiled: July 31, 2006Date of Patent: February 26, 2013Assignee: STMicroelectronics R&D LimitedInventor: Andrew Dellow
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Publication number: 20110158853Abstract: The disclosure relates to a pixel-type biological analysis device comprising a photosensitive layer, a capture mixture for the capture of targeted proteins, the capture mixture being placed on an external surface of the photosensitive layer and comprising a protein probe grafted to a hydrogel, collection means for collecting photoelectrons in the photosensitive layer, and reading and treatment means of an electrical quantity supplied by the collection means, for the supply of a characteristic value of a luminous intensity detected by the photosensitive layer.Type: ApplicationFiled: December 16, 2010Publication date: June 30, 2011Applicants: STMICROELECTRONICS R&D LIMITED, UNIVERSITE PAUL CEZANNE AIX MARSEILLE IIIInventors: Jeffrey M. Raynor, Michael Maurin, Mitchell O'Neal Perley, Pierre-Francois Lenne, Hervé Rigneault, Renaud Vincentelli
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Publication number: 20110140208Abstract: The disclosure relates to a fabrication process of a biosensor on a semiconductor wafer, comprising steps of: making a central photosensitive zone comprising at least one pixel-type biological analysis device comprising a photosensitive layer, and a first peripheral zone surrounding the central photosensitive zone, comprising electronic circuits. The first peripheral zone is covered by a hydrophilic coating, and the central photosensitive zone is covered with a hydrophobic coating. A barrier of a bio-compatible resin is formed on the second peripheral zone.Type: ApplicationFiled: December 16, 2010Publication date: June 16, 2011Applicants: STMICROELECTRONICS R&D LIMITED, UNIVERSITE PAUL CEZANNE AIX MARSEILLE IIIInventors: Jeffrey M. Raynor, Michaël Maurin, Mitchell O'Neal Perley, Pierre-Francois Lenne, Herve Rigneault, Renaud Vincentelli
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Patent number: 7956431Abstract: A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.Type: GrantFiled: October 20, 2008Date of Patent: June 7, 2011Assignees: STMicroelectronics Rousset SAS, STMicroelectronics R&D LimitedInventors: Brendan Dunne, Kevin Channon, Eric Christison, Robert Nicol
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Publication number: 20090267172Abstract: A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.Type: ApplicationFiled: October 20, 2008Publication date: October 29, 2009Applicants: STMicroelectronics Rousset SAS, STMicroelectronics R&D LimitedInventors: Brendan Dunne, Kevin Channon, Eric Christison, Robert Nicol