Abstract: An integrated electronic circuit including: a dielectric body delimited by a front surface; A top conductive region of an integrated electronic circuit extend within a dielectric body having a front surface. A passivation structure including a bottom portion and a top portion laterally delimits an opening. The bottom portion extends on the front surface, and the top portion extends on the bottom portion. A field plate includes an internal portion and an external portion. The internal portion is located within the opening and extends on the top portion of the passivation structure. The external portion extends laterally with respect to the top portion of the passivation structure and contacts at a bottom one of: the dielectric body or the bottom portion of the passivation structure. The opening and the external portion are arranged on opposite sides of the top portion of the passivation structure.

Abstract: A MEMS actuator includes a mobile mass suspended over a substrate in a first direction and extending in a plane that defines a second direction and a third direction perpendicular thereto. Elastic elements arranged between the substrate and the mobile mass have a first compliance in a direction parallel to the first direction that is lower than a second compliance in a direction parallel to the second direction. Piezoelectric actuation structures have a portion fixed with respect to the substrate and a portion that deforms in the first direction in response to an actuation voltage. Movement-transformation structures coupled to the piezoelectric actuation structures include an elastic movement-conversion structure arranged between the piezoelectric actuation structures and the mobile mass. The elastic movement-conversion structure is compliant in a plane formed by the first and second directions and has first and second principal axes of inertia transverse to the first and second directions.

Abstract: A MEMS device for detecting particulate and gases in the air, comprising: a first semiconductor body; a second semiconductor body with a first surface facing a first surface of the first semiconductor body; and a first spacer element and a second spacer element, which extend between the first surfaces of the semiconductor bodies so as to arrange them at a distance apart from one another and define a first duct. The MEMS device further comprises at least one of the following: a first particulate sensor comprising a first emitter unit for generating acoustic waves in the first duct, and a first particulate-detection unit for detecting the particulate, the first emitter unit and the first particulate-detection unit facing one another through the first duct; and a first gas sensor, which faces the first duct and is configured to detect said gases in the air present in the first duct.

Abstract: A merged-PN-Schottky, MPS, diode includes an N substrate, an N-drift layer, a P-doped region in the drift layer, an ohmic contact on the P-doped region, a plurality of cells within the P-doped region and being portions of the drift layer where the P-doped region is absent, an anode metallization on the ohmic contact and on said cells, to form junction-barrier contacts and Schottky contacts respectively. The P-doped region has a grid-shaped layout separating from one another each cell and defining, together with the cells, an active area of the MPS diode. Each cell has a same geometry among quadrangular, quadrangular with rounded corners and circular; and the ohmic contact extends at the doped region with continuity along the grid-shaped layout.

Abstract: A system on chip includes a monitoring circuit that detects an anomalous behavior of the system on chip. The monitoring circuit compares a behavior of the system on chip to at least one reference parameter representing the anomalous behavior of the system. Using this comparison, the anomalous behavior of the system on chip is detected. An interrupt is the issued in response to the detected anomalous behavior of the system on chip.

Abstract: A secure device operating with a secure tamper-resistant platform including a tamper-resistant hardware platform and a virtual primary platform operating with a low level operating system performing an abstraction of resources of the hardware platform, and a secondary platform with a high level operating system providing a further abstraction of resources to applications in which respective internal hosts are embedded, the secure device including an internal host domain including the internal hosts, the secure device including a plurality of physical and/or logical input/output interfaces through which external hosts can access the internal hosts, the virtual primary platform being configured to set interactions between the external hosts and the internal hosts, wherein the internal host domain includes a further set of virtual hosts each configured to operate as a proxy between an input/output interface and an application, each input/output interface being configured to address only one among the virtual hos

Abstract: A method, includes: providing at least one set of data; composing a data stream including compressed data from the at least one set of data, the at least one set of data having embedded therein a respective counter indicative of the at least one set of data, the respective counter being losslessly encoded into the compressed data; transmitting the data stream over a transmission channel; receiving the data stream; and recovering, from the data stream, the respective counter.

Abstract: A semiconductor device for ambient sensing including: a cap traversed by a hole; and a main body mechanically coupled to the cap so as to delimit a cavity, which is interposed between the main body and the cap. The main body includes a semiconductor body and a coupling structure, which is interposed between the semiconductor body and the cap and laterally delimits a channel, which fluidically couples the cavity and the hole. The channel performs a mechanical filtering that is finer than the mechanical filtering performed by the hole.

Abstract: An ESD protection circuit includes a terminal connected to the cathode of a first diode and to the anode of a second diode, where the cathode of the second diode is not made of epitaxial silicon.

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

Abstract: A device includes a charge variation sensor having at one or more electrodes. The charge variation sensor, in operation, generates a charge variation signal indicative of changes in an electric or electrostatic charge induced on the one or more electrodes by an alternating current power source. Processing circuitry, coupled to the charge variation sensor, generates a frequency spectrum signal based on the charge variation signal and identifies a frequency of operation associated with the alternating current power source based on the generated frequency spectrum signal. A control signal is generated based on the identified frequency of operation. An image acquisition device sets an image acquisition frequency based on the control signal.

Abstract: An embodiment apparatus comprises a switching-type output power stage, a modulator circuit configured for carrying out a pulse-width modulation and converting an electrical input signal into an input signal pulsed between two electrical levels, having a mean value proportional to the amplitude of the input signal, and a circuit arrangement for controlling saturation of an output signal supplied by the switching-type output power stage. The circuit arrangement comprises a pulse-remodulator circuit, between the output of the modulator circuit and the input of the switching-type output power stage, that is configured for supplying, as a driving signal to the switching-type output power stage, a respective modulated signal pulsed between two electrical levels, measuring a pulse width as pulse time interval elapsing between two consecutive pulsed-signal edges of the pulsed input signal, and, if the measurement indicates that the latter is below a given minimum value, remodulating the pulsed input signal.

Abstract: A solid reagent containment unit is formed by a support; a frame body fixed to the support and delimiting internally, together with the support, an analysis volume; a reagent-adhesion structure within the analysis volume; and at least one reagent cavity, which extends within the reagent-adhesion structure. The reagent-adhesion structure is of an adhesion material embossable at temperatures lower by 6-8° C. than its own melting point and has a melting point such as not to interfere with the analysis. The reagent cavity forms a retention wall, laterally surrounding the reagent cavity, and houses dried reagents. The adhesion material is chosen among wax, such as paraffin, a polymer, such as polycaprolactone, a solid fat, such as cocoa butter, and a gel, such as hydrogel or organogel.

Abstract: Tray for containing electronic components formed by a bearing body, substantially planar, having a first and a second face. First holding structures extend from the first face of the bearing body and second holding structures extend from the second face of the bearing body. Each second holding structure is aligned with a respective first holding structure in a vertical direction perpendicular to the first and the second faces of the bearing body. Each first holding structure is formed by first protrusions mutually spaced by first spaces and arranged along a first closed line; each second holding structure is formed by second protrusions mutually spaced by second spaces and arranged along a second closed line. Each second protrusion is aligned, in parallel with the vertical direction, with the first spaces and each first protrusion is aligned, in parallel with the vertical direction, with the second spaces.

Abstract: Current signals indicative of sensed physical quantities are collected from sensing transistors in an array of sensing transistors. The sensing transistors have respective control nodes and current channel paths therethrough between respective first nodes and a second node common to the sensing transistors. A bias voltage level is applied to the respective first nodes of the sensing transistors in the array and one sensing transistor in the array of sensing transistors is selected. The selected sensing transistor is decoupled from the bias voltage level, while the remaining sensing transistors in the array of sensing transistors maintain coupling to the bias voltage level. The respective first node of the selected sensing transistor in the array of sensing transistors is coupled to an output node, and an output current signal is collected from the output node.

Abstract: A master device issues memory burst transaction requests via an interconnection bus to fetch data from a slave device. A cipher engine is coupled to the interconnection bus and decrypts the fetched data to produce plaintext data for the master device. The cipher engine selectively operates according to a stream cipher operation mode, or a block cipher operation mode. The cipher engine is configured to stall a read data channel of the interconnection bus between the slave device and the master device in response to the cipher engine switching from the block cipher operation mode to the stream cipher operation mode. The read data channel is reactivated in response to a last beat of a read burst of the plaintext data produced by the cryptographic engine.

Abstract: A microelectromechanical mirror device has, in a die of semiconductor material: a fixed structure defining a cavity; a tiltable structure carrying a reflecting region elastically suspended above the cavity; at least a first pair of driving arms coupled to the tiltable structure and carrying respective piezoelectric material regions which may be biased to cause a rotation thereof around at least one rotation axis; elastic suspension elements coupling the tiltable structure elastically to the fixed structure and which are stiff with respect to movements out of the horizontal plane and yielding with respect to torsion; and a piezoresistive sensor configured to provide a detection signal indicative of the rotation of the tiltable structure. At least one test structure is integrated in the die to provide a calibration signal indicative of a sensitivity variation of the piezoresistive sensor in order to calibrate the detection signal.

Abstract: A convolutional neural network includes a pooling unit. The pooling unit performs pooling operations between convolution layers of the convolutional neural network. The pooling unit includes hardware blocks that promote computational and area efficiency in the convolutional neural network.

Abstract: A system for detecting a presence in an environment to be monitored includes an electrostatic charge variation sensor, a vibration sensor, and an environmental pressure sensor. A processing unit is configured to acquire, from the electrostatic charge variation sensor, an electrostatic charge variation signal, and detect in the electrostatic charge variation signal, first signal characteristics indicative of the presence of a subject in the environment to be monitored. The processing unit further validates the detection of presence of the subject using the vibration and pressure signals provided by the other sensors.

Abstract: A device includes signal processing circuits, a RAM, and RAM management circuitry. The signal processing circuits produce output data signals as a function of current and past values of sensor data signals. The RAM is organized into a set of RAM sections storing sensor data signal values. The RAM management circuitry has a buffer accessible by the plurality of signal processing circuits, and manages storage and retrieval of data in the RAM sections independently of one another by executing sets of memory operations. A set of memory operations includes a read operation, during which past values of sensor data signals are read from a section of the RAM and stored in the buffer, and a write operation, during which current values of sensor data signals are written into the section of the RAM read during the read operation.