Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: A frame includes leadframe units arranged in a matrix. Each leadframe unit has a die pad and tie bars connected to and extending from the die pad. Each tie bar includes an internal tie bar portion and an external tie bar portion. The internal tie bar portion of at least one tie bar includes a cut separating a part of the internal tie bar portion from the external tie bar portion. An out-of-plane bend in that part forms a mold flow control structure.

Abstract: A lead frame includes a die pad and electrical leads. An integrated circuit chip is mounted to the die pad. An encapsulating package has a perimeter defined by first, second, third and fourth sidewalls. The electrical leads extend from the opposed first and second sidewalls of the package. At least one sidewall of the opposed third and fourth sidewalls of the package includes a V-shaped concavity functioning to increase a creepage distance between the electrical leads at the opposed first and second sidewalls.

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: A frame includes leadframe units arranged in a matrix. Each leadframe unit has a die pad and tie bars connected to and extending from the die pad. Each tie bar includes an internal tie bar portion and an external tie bar portion. The internal tie bar portion of at least one tie bar includes a cut separating a part of the internal tie bar portion from the external tie bar portion. An out-of-plane bend in that part forms a mold flow control structure.

Abstract: An integrated circuit (IC) device includes an IC die and a plurality of leads. Each lead includes an unplated proximal end including a first material, and an unplated distal end including the first material. A plated bond wire portion extends between the proximal and distal ends and includes the first material and a plating of a second material thereon. A plurality of bond wires extend between the IC die and the plated bond wire portions of the leads. An encapsulation material surrounds the IC die and bond wires so that the unplated proximal end and plated bond wire portion of each lead are covered by the encapsulation material.

Abstract: An integrated circuit (IC) device includes an IC die and a plurality of leads. Each lead includes an unplated proximal end including a first material, and an unplated distal end including the first material. A plated bond wire portion extends between the proximal and distal ends and includes the first material and a plating of a second material thereon. A plurality of bond wires extend between the IC die and the plated bond wire portions of the leads. An encapsulation material surrounds the IC die and bond wires so that the unplated proximal end and plated bond wire portion of each lead are covered by the encapsulation material.

Abstract: A lead-frame for semiconductor devices having a mold with at least one air vent for the resin to seep out of during its injecting into the mold, the air vent being positioned between the upper and lower surface of the frame, wherein the frame provides a through hole positioned at the outlet of the air vent so that, when the resin has solidified, it forms a flash which is in coherence with the surface of the frame.

Abstract: A test handler apparatus, having a treatment area; a testing station in the treatment area; and an output unit connected to an output of the treatment area. An input unit picks singulated or stripped packages and unloads them on carrier boats in a loading zone; a conveyor mechanism transfers the carrier boats from the loading zone through the treatment area to the testing station and from the testing station to the output unit. In practice, the carrier boat forms a universal carrier which is able to contain multiple singulated or strip packages for the purpose of testing. Placing packages onto carriers with standardized dimension allows handler equipment to accommodate the packages in singulated or strip condition.