Abstract: Integrated circuits and methods for fabricating integrated circuits are provided. In an embodiment, an integrated circuit includes a standard cell having a first boundary, a second boundary opposite the first boundary, a third boundary interconnecting the first and second boundaries, and a fourth boundary opposite the third boundary and interconnecting the first and second boundaries. The standard cell further includes parallel active areas extending from the first boundary to the second boundary. Also, the standard cell has parallel gate strips extending from the third boundary to the fourth boundary and over the active areas. A cut mask overlies the gate strips. An interconnect is positioned overlying the cut mask and forms an electrical connection with a selected gate strip.
Type:
Application
Filed:
June 7, 2012
Publication date:
December 12, 2013
Applicants:
Globalfoundries Inc., STMircoelectronics Inc., International Business Machines Corporation
Inventors:
Globalfoundries Inc., International Business Machines Corporation, STMircoelectronics Inc.