Patents Assigned to STMMicroelectronics (Research & Development) Limted
  • Publication number: 20120312963
    Abstract: Each column of pixels in an image sensor array has at least two column bitlines connected to an output of each pixel. A readout input circuit includes first inputs and a second input. Each first input is connected, via a capacitance, to a comparator input node. The second input is connected via a capacitance to the same comparator input node. The first inputs receive, in parallel, an analog signal acquired from the pixels via the column bitlines. The analog signals vary during a pixel readout period and have a first level during a first calibration period and a second level during a second read period with the analog signals being constantly read onto the capacitances during both the first calibration period and the second read period. The comparator compares an average of the signals on the plurality of first inputs to the reference signal.
    Type: Application
    Filed: December 13, 2011
    Publication date: December 13, 2012
    Applicant: STMMicroelectronics (Research & Development) Limted
    Inventors: Graeme STORM, Matthew PURCELL, Derek TOLMIE, John Kevin MOORE, Michael WIGLEY
  • RAM
    Publication number: 20040191984
    Abstract: A method for forming in monolithic form a DRAM-type memory, including the steps of forming, on a substrate, parallel strips including a lower insulating layer, a strongly-conductive layer, a single-crystal semiconductor layer, and an upper insulating layer; digging, perpendicularly to the strips, into the upper insulating layer and into a portion of the semiconductor layer, first and second parallel trenches, each first and second trench being shared by neighboring cells; forming, in each first trench, a first conductive line according to the strip width; forming, in each second trench, two second distinct parallel conductive lines, insulated from the peripheral layers; filling the first and second trenches with an insulating material; removing the remaining portions of the upper insulating layer; and depositing a conductive layer.
    Type: Application
    Filed: April 2, 2004
    Publication date: September 30, 2004
    Applicant: STMmicroelectronics S.A.
    Inventors: Marc Piazza, Philippe Coronel