Abstract: A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.

Abstract: A grinding machine wherein coarse and fine grind wheels are mounted to a single rotating spindle. A multiple grind wheel mount is attached to the lower portion of the rotating spindle, the coarse and fine wheels being supported by the wheel mount, the wheel mount containing the mechanism for moving the inner coarse wheel down relative to the stationary outer fine wheel.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly.

Abstract: The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the passage of a vacuum signal, a frame holding the protective material, a frame holder to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method provided by the invention can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: In a type of end effector used for handling wafers in the semiconductor industry, the wafer is acquired by lowering the end effector until it almost touches the upper side of the wafer and then applying suction to lift the water into contact with a wafer contacting surface on the underside of the end effector. Release of the wafer is accomplished by relieving the suction or replacing it with a small overpressure. Wet thin wafers do not reliably release; the liquid spreads into a thin film between the upper side of the wafer and the wafer contacting surface, and the surface tension of this film causes the thin wet wafer to adhere to the wafer contacting surface. This problem is solved by affixing a sheet of a porous resilient material, such as open cell MYLAR®, to the wafer contacting surface.

Abstract: A CMP slurry pumping system which uses the slurry pump inlet pressure as input to the pump controller, and adjusts pump speed to account for variations in inlet pressure.

Abstract: An optical endpoint system for a CMP system with a viewport located off-center on the platen, said view port being adjustable in height so that the window of the viewport can be made flush with the top of the polishing pad.

Abstract: A load station is used in a planarizing machine to perform several useful functions related to handling of a wafer. By centering the wafer with respect to a spindle carrier the load station interrupts the accumulation of positional errors. The load station never makes solid contact with the wafer, but instead the wafer is continually levitated on three cushions of water that are directed upwardly against the lower face of the wafer. The presence of the wafer partially impedes the flow of water from the nozzles used for levitation causing an increase in the water pressure immediately upstream of the nozzles. This increased pressure is sensed and used as an indicator of the presence of a wafer at the load station. The load station further includes a nozzle that directs a stream against the lower side of the wafer so as to elevate the wafer from the load station into the carrier.

Abstract: Programmable electric and hydraulic machine for shaping laps such as are used to form or polish opthalmic lenses, comprises vertically oscillatable, longitudinally displaceable arm carrying a point cutter which is functionally engageable by radially extensible, rotating lap carried by upstanding spindle. Alternately, spindle is operable by oscillating drive when lap is radially retracted. Toroidal or spherical laps having a large range of variance in two dimensions, i.e. curvatures, are thus obtained by using relevant cutter and lap locations, as well as appropriate drive settings. Concave laps are produced by exchanging locations of lap and cutter so workpiece is carried by vertical-moving arm.

Abstract: A programmable machine for automatically cutting and/or resurfacing a selected arcuate pattern upon either a convex or concave lap, particularly such laps as may then be used for forming and polishing opthalmic lenses. A lap positioning unit and a cutter positioning unit are located respectively on adjacent upright and horizontal supports so as to bring the lap and cutter into mutual engagement, each unit initially being longitudinally adjustable from a respective pivot point by a selected amount so as to determine the particular arcuate curvature obtained, which curvatures jointly form the two-dimentional arcuate pattern chosen for the lap face. In operation, the lap is oscillated vertically and a rotary milling cutter is driven back and forth transverse thereto.

Abstract: A chuck assembly particlarly useful to position a lap or lens blank at the end of an oscillatory spindle for opthalmic lens grinding; comprises an opposing pair of jaws, one of which is fixed and the other a loosely hanging plate, laterally and longitudinally tiltable between engage and disengage positions by selective action of a fluid-operated piston having a conic contact head which distally abuts the jaw plate for leveraged closing fulcrumed against a workpiece-adjacent edge, in opposition to resilient means biased to hold the jaw open.