Abstract: An assembly including a fiber optic cable assembled with a one-piece ferrule where a gap exists between the fiber optic cable and the ferrule. When the fiber optic cable is mounted to the ferrule, the optical fiber is positioned within a small opening and the sheath is positioned within a large opening of the ferrule. The gap exists between the optical fiber and the small opening. The metallic material is then adhered to a portion of the optical fiber and to a portion of the ferrule so as to form the hermetic seal at the gap. The layer of the metallic material can be deposited by way of a metal vapor deposition process. Another assembly may include multiple fiber optic cables trapped between two substrates where any gaps formed between the two substrates are hermetically sealed with a metallic material.

Abstract: An optoelectronic interconnect module comprising a housing having a first aperture on a first side of the housing for receiving an optical ferrule and a second aperture on a second side of the housing for receiving a semiconductor die. A mirror is mounted within the housing at an angle for reflecting optical transmissions between the first and second apertures. A first optical lens is mounted between the first aperture and the mirror, and a second optical lens is mounted between the second aperture and the mirror. The optoelectronic interconnect module transmits an electronically modulated optical signal between an optical fiber in the first aperture and an optoelectronic semiconductor die adjacent to the second aperture within a mutually orthogonal plane.

Abstract: A connector for mounting to and through a wall of a device. In one form of the invention a connector is used for mounting to and through a wall of a device. The connector includes a body, an optical fiber, and a sealant. The body includes a surface having an aperture. The optical fiber has a length and a first end and a second end. A portion of the length of the optical fiber being metallized. The optical fiber passes through the aperture of the surface of the body and the metallized portion of the optical fiber is attached to the aperture of the surface of the body so as to form a hermetic seal between the optical fiber and the aperture of the surface of the body. The sealant is located between the body and the surface of the device so as to provide a hermetic seal between the body and the wall of the device when the body is urged toward the wall of the device thus deforming the sealant. The connector allows an optical signal to be transmitted within the optical fiber through the body.

Abstract: Automatic power control (APC) is provided by a) a variable output voltage differential receiver/driver, which receiver is responsive to data signals for generating a voltage, the laser driver output voltage amplitude being controlled by a first potentiometer on an integrated circuit generating an AC current signal for summing with a DC current signal to provide a laser drive current signal to b) a laser transmitter having a laser diode, said laser diode for producing optical power over an optical transfer medium and a photodiode for producing a feedback signal in response to said optical power, the APC including c) a power stabilizing circuit including an error amplifier, a second potentiometer and a bias current drive transistor, the error amplifier having inputs for both the feedback signal and a voltage reference to generate an output control signal, the second potentiometer affecting said output control signal, and said bias current drive transistor being responsive to said output control signal for suppl

Abstract: A device or array of arrayed optical subassemblies includes modular units called one channel sub-assemblies. Each of the one channel sub-assemblies includes a small format optical subassembly attached to a substrate and an optical coupling element all of which is connected to a base. The optical coupling element includes a focusing element and a ferrule receiving bore. The arrayed device makes it possible to remove and replace one of the one channel sub-assemblies with another one channel sub-assembly. The small format optical subassembly of the one channel sub-assembly may be a transmitter or a receiver. Thus, the device is a modular, high-density, multiple optical transmitter/receiver array.

Abstract: A device including two modules is provided for transferring data signals from a first transmission medium to a second transmission medium. One module includes a conductive housing having a first end and a second end. An electrical connector is mounted at the first end of the housing and is configured to mate to a corresponding connector associated with the first transmission medium. The housing includes a flexible metallic shielded cable extending from the second end. The remote end of the shielded cable is connected to the second module which is configured to mate to a corresponding connector associated with the second transmission medium. The device is pluggable into two system hosts, simultaneously. The modules are each hot pluggable. The device acts as a serial patch cord between the two system hosts, with a standard form factor module plugged into the system hosts at either end.

Abstract: An optical transceiver module includes a transmitter portion and receiver portion positioned within a housing with an EMI shield therebetween, and wherein the transmitter and receiver portions include respective substrates, or circuit boards, with opposing and spaced apart major surfaces. The port density, when using a plurality of such modules, is increased, while providing enhanced EMI shielding. Each circuit board may include a ground plane and have a plurality of generally L-shaped conductive leads extending outwardly from the respective circuit boards. The optical transmitter and optical receiver portions each preferably further comprise at least one active component mounted on the first major surfaces. Accordingly, these active components face one another.

Abstract: The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electro-magnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Abstract: A pluggable optical transceiver module includes two optoelectronic devices mounted to a printed circuit board, and a High Speed Serial Data Connector connected to the printed circuit board. The printed circuit board, and associated optoelectronic devices and the High Speed Serial Data Connector being mounted in a housing. One of the two optoelectronic devices is a transmitter. The other of the two optoelectronic devices is a receiver. The pluggable optical transceiver module converts optical signal to electrical signals, and, also, converts electrical signals to optical signals. The High Speed Serial Data Connector is pluggable into a High Speed Serial Data Connector receptacle of a host device. Another portion of the module may have ports for receiving LC style fiber optic connectors.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The first region has the electrically conductive plating material applied thereto. The first and second through-holes protrudes through the second region.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a circuit board having an optical subassembly mounted thereon. The module housing may be pluggable via a retention member received within the receptacle. The module and receptacle assembly may include grounding means such as a ground clip mounted within a gap provided between the module and a connector port of the receptacle to limit electromagnetic emissions.

Abstract: An interface converter module is provided for converting data signals from a first transmission medium to a second transmission medium. The module is housed within a metallized housing having a first end and a second end. A shielded electrical connector is mounted at the first end of the housing and configured to mate to a corresponding connector associated with a first transmission medium. The housing includes a flexible metallic shielded cable having extending from the second end. The remote end of the shielded cable comprises the media interface which includes and interface connector configured to the connect the flexible shielded cable to the serial transmission medium. A printed circuit board is mounted within the housing and has mounted thereon electronic circuitry configured to convert data signals from a host device transmission medium to the second transmission medium.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region.

Abstract: MT ferrule. A polymer fiber optic MT ferrule includes hermaphroditic L-shaped halves having multiple fibers mounted in V-grooves formed within surfaces of ferrule halves. Ferrule halves include holed walls perpendicular to the major surface of the V-grooves for providing alignment of the ferrule to guide pins of an MT receptacle having an alignment assembly and an alignment member mounted within the alignment assembly to provide for precision alignment.

Abstract: A shared communications device includes a multi-port jack housing having portions defining a plurality of recesses extending inwardly from the front for receiving respective mating plugs. Signal connectors are preferably positioned within each of the recesses and define respective communications ports. A circuit board is positioned within the multi-port jack housing and preferably extends adjacent the back. The shared communications device preferably includes at least one shared communications processor mounted on the circuit board and connected to the plurality of communications ports for processing inbound and outbound communications signals so that the signals are shared among the communications ports. A shared communications processor preferably communicates with two or more of the communications ports. In embodiments including a plurality of shared communications processors, a communications repeater bus is provided on the circuit board interconnecting the shared communications processors.

Abstract: An optoelectronic transceiver is provided having an adaptable logic level signal detect output. The preferred embodiments are configured to generate various logic level signal detected signals directly for use by the transceiver host device. A first embodiment generates the SD output based on the actual optical power received over the optical transfer medium. When the received optical power exceeds a predetermined threshold, the monitor voltage exceeds the reference voltage, and the signal detected output is set. The output stage of the circuit can be configured such that in the true state, meaning a signal has been detected, a TTL level signal, a CMOS signal, or a high voltage or high current signal is set to true. The high voltage and high current configurations may be set to any value required under the specific requirements of the application. In a second embodiment an AC signal detecting circuit generates the SD output.

Abstract: A device which retains a polymer mounting block between a metallic cover and a metallic base. The mounting block includes two mounting halves. The mounting halves being hermaphroditic such that a pair of the mounting halves of the mounting block being substantially identical can be assembled in opposite transverse relation to form the mounting block. The mounting half of the mounting block includes a member and two latch arms attached to the member. The member includes a transmitter mounting provision and a receiver mounting provision. The transmitter mounting provision receives a transmitter sub-assembly, and the receiver mounting provision receives a receiver sub-assembly. The transmitter mounting provision and the receiver mounting provision straddle the second latch arm, and the first latch arm and the second latch arm straddle one of the transmitter mounting provision and the receiver mounting provision.

Abstract: A tool for inserting and removing a plug insert for the termination device includes a body, a plunger, a pin, and a spring. The body has a main aperture formed through the length of the body. The main aperture has a spring seat formed therein. The body also has a pin travel aperture formed through a diameter of the body and substantially perpendicular to the main aperture. The plunger has a large diameter region and a small diameter region. The large diameter region having a spring seat formed thereon. A portion of both the small diameter region and the large diameter region are slidable provided in the main aperture of the body. The spring is provided in the main aperture of the body. The spring surrounds a portion of the small diameter region of the plunger.

Abstract: A module is provided for attaching to a flexible shielded cable including individual conductors. The module includes a die cast housing, a printed circuit board mounted within the die cast metal housing, a metal D-shell ribbon style host connector associated with the die cast metal housing, first and second apertures formed in the die cast metal housing, first and second guide tabs formed on the printed circuit board and arranged to protrude through the first and second apertures, and insulation displacement contact (IDC) connector header mounted within the die cast metal housing, and an insulation displacement contact (IDC) cover insert affixed to the die cast metal housing so as to engage individual conductors and forces the conductors onto the knife contacts of the IDC connector header when the two are brought together. The die cast metal housing having a base member and a cover. The module is hot pluggable.

Abstract: A bus bar assembly having a high-speed switching device, a bus bar, and a heat sink. The switching device is integrated into a cavity on the top surface of the bus bar, and the heat sink is mechanically coupled to the bottom surface of the bus bar. The bus bar may include capacitors that are positioned upside down on the top surface of the bus bar to more effectively communicate heat from the capacitor to the bus bar and then the heat sink. The heat sink may be formed from a pair of parallel plates that oppose each another to form a cooling channel, wherein a coolant, such as gas or water, may be passed through. An interior surface of one of the plates may incorporate a cooling structure such as grooves or fins.