Abstract: A liquefier assembly for use in an additive manufacturing system, which includes a rigid member having a gap, a liquefier tube operably disposed in the gap, one or more heater assemblies disposed in the gap in contact with the liquefier tube, and configured to heat the liquefier tube in a zone-by-zone manner, preferably one or more thermal resistors disposed in the gap between the rigid member and the heater assemblies, and preferably one or more sensors configured to operably measure pressure within the liquefier tube. The one or more heater assemblies may be operated to provide dynamic heat flow control.

Abstract: A method for printing a three-dimensional part with an additive manufacturing system, the method comprising generating and printing a planarizing part having a substantially-planar top surface relative to a build plane, and a bottom surface that substantially mirrors a topography of a platen surface, and printing the three-dimensional part over the substantially-planar top surface of the printed planarizing part.

Abstract: An additive manufacturing system for printing a chocolate confection, the system comprising a platen, a print head, and a cartridge configured to be removably secured to the print head, wherein the cartridge contains a supply of the chocolate material.

Abstract: Disclosed are high-performance thermoplastic materials used in building a three-dimensional model and its supports, by fused deposition modeling techniques. In a preferred embodiment, the thermoplastic resin comprising the modeling material is selected from the group consisting of a polycarbonate resin, a polyphenylsulfone resin, and a polycarbonate/acrylonitrile-butadiene-styrene resin. An amorphous thermoplastic resin which self-laminates, bonds weakly to the modeling material, has a heat deflection temperature similar to the heat deflection temperature of the modeling material, and has a tensile strength of between 5000 psi and 12,000 psi comprises a support material. In a preferred embodiment, the thermoplastic resin comprising the support material is selected from the group consisting of a polyphenylene ether and polyolefin blend, a polyphenylsulfone and amorphous polyamide blend, and a polyphenylsulfone, polysulfone and amorphous polyamide blend.