Patents Assigned to Streag CVD Systems LTD
  • Wafer processing with water vapor pumping
    Patent number: 6362096
    Abstract: A method and apparatus for selectively depositing hemispherical grained silicon on the surface of a wafer in a process chamber. The chamber is evacuated so that a partial pressure of water vapor in the chamber is less than 10−7 torr, preferably using a turbomolecular pump and a water vapor pump in cooperation. A process gas mixture including silicon is introduced into the chamber. The surface of the wafer is seeded with silicon nuclei, and the wafer is annealed to convert the silicon to HSG.
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: March 26, 2002
    Assignee: Streag CVD Systems LTD
    Inventors: Arie Harnik, Michael Sandler, Itai Bransky