Patents Assigned to Stroke Precision Advanced Engineering Co., Ltd.
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Publication number: 20250022836Abstract: A device configured to partially flatten a substrate includes a carrying platform and a pressing airflow generator. The carrying platform has a carrying plane and is configured to carry the substrate to be flattened on the carrying plane. The pressing airflow generator includes a body having an airflow guiding channel disposed thereon, an actuator capable of driving the body to move along the carrying plane relative to the carrying platform, and an air pump capable of providing an airflow to the airflow guiding channel of the body. The airflow guiding channel can guide the airflow to lift up the body from the carrying platform, thereby creating a pressing airflow between the body and the carrying platform. An apparatus configured to bond an electronic component and methods for bonding an electronic component and manufacturing a light-emitting diode display are also provided.Type: ApplicationFiled: April 19, 2024Publication date: January 16, 2025Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventor: Chingju Lin
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Publication number: 20240404437Abstract: A method for repairing an electronic substrate by removing a bad electronic component from a pad on the electronic substrate uses steps of: providing a control pad image; providing an image of the pad with which the bad electronic component is bonded; comparing the image of the pad with which the bad electronic component is bonded with the control pad image to determine a difference between the said images; generating a positioning directive based on the difference, and following the positioning directive to position the bad electronic component; and applying an energy beam onto the positioned bad electronic component to deconstruct a bonding between the positioned bad electronic component and the pad. A method for making an LED display is also provided.Type: ApplicationFiled: April 18, 2024Publication date: December 5, 2024Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Minchi Li, Ming Feng Du
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Publication number: 20240213209Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier having a first surface on which the electronic device to be transferred is disposed and a second surface, a target substrate, a target substrate, and a light-transmissible pin having a pressing end are provided. The flexible carrier is spaced from the target substrate with the first surface thereof facing the target substrate. The flexible carrier is deformed by exerting the pin to press the second surface with the pressing end thereof at a position corresponding to the electronic device until the electronic device is in contact with the target substrate. An energy beam emitted from a light source standing outside the pin and then traveling through the pin and going out from the pressing end to bond the electronic device onto the target substrate is applied. The pin is released from pressing the flexible carrier.Type: ApplicationFiled: March 5, 2024Publication date: June 27, 2024Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Yu-Min Huang, Sheng Che Huang, Chingju Lin, Wei-Hao Wang
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Publication number: 20240203934Abstract: An apparatus for bonding an electronic component including a first carrier, a second carrier, a driving mechanism, and a substrate adjustment mechanism is disclosed. The first carrier is configured to carry a first substrate and has a first carrying surface. The second carrier is configured to carry a second substrate and has a second carrying surface. The driving mechanism enables the first carrier and the second carrier to act in close proximity to each other and far away from each other. The substrate adjustment mechanism enables the first substrate and the second substrate disposed to be in a non-parallel configuration.Type: ApplicationFiled: November 23, 2023Publication date: June 20, 2024Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Chingju Lin, Sheng-Che Huang
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Publication number: 20240145427Abstract: An apparatus configured to transfer an electronic component, including a first carrier, a second carrier, an actuator mechanism, and a flexible push generator, is provided. The first carrier is configured to carry a target substrate. The second carrier is configured to carry a transfer substrate. The actuator mechanism is configured to actuate the first and second carriers to move close to and away from each other. The flexible push generator generates a flexible push to the carried target substrate or transfer substrate when the first and second carriers move close to each other. When the flexible push is starting to be generated, a flexible push generated on a central area of the target substrate or the transfer substrate is greater than that on a surrounding area. A method for bonding an electronic component and a method for manufacturing a light-emitting diode display are also provided.Type: ApplicationFiled: August 16, 2023Publication date: May 2, 2024Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventor: Chingju Lin
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Patent number: 11973054Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.Type: GrantFiled: January 18, 2022Date of Patent: April 30, 2024Assignee: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Yu-Min Huang, Sheng Che Huang, Chingju Lin, Wei-Hao Wang
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Publication number: 20240105671Abstract: An apparatus for transferring an electronic component including a first platform, a second platform, an actuator mechanism, and a flexible push generator is provided. The first platform is configured to carry a carrier substrate. The second platform is configured to carry a target substrate. The actuator mechanism is configured to actuate the first platform and the second platform to approach and move away from each other. The flexible push generator is disposed near the first platform or the second platform and generating a plurality of flexible pushes toward the first platform and the second platform in response to the first platform and the second platform actuated in a way that the first platform and the second platform approach each other.Type: ApplicationFiled: August 10, 2023Publication date: March 28, 2024Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Chien-Shou Liao, Chingju Lin
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Publication number: 20240006564Abstract: A device configured to bond an electronic component includes a carrying platform, a pressing element, a closed space generating mechanism, a gas extracting mechanism, and an energy generating mechanism. The carrying platform is configured to carry a target substrate and a carrying substrate carrying the electronic component on the target substrate. The pressing element is made of a flexible material. The closed space generating mechanism is capable of putting the pressing element onto the carrying platform, so as to form a closed space between the pressing element and the carrying platform. The gas extracting mechanism is configured to extract gas from the closed space. The energy generating mechanism is disposed near the carrying platform, and configured to generate energy toward the carrying platform. A method for bonding an electronic component and a method for manufacturing a light-emitting diode (LED) display are also provided.Type: ApplicationFiled: June 26, 2023Publication date: January 4, 2024Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Chingju Lin, Sheng-Che Huang, Shao-Wei Huang
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Publication number: 20230402562Abstract: A transferring apparatus configured to transfer an electronic component includes a first carrier, a second carrier, an actuator mechanism, and a flexible push generator. The first carrier is configured to carry an objective substrate, and the second carrier is configured to carry a transfer substrate. The actuator mechanism is configured to actuate the first carrier and the second carrier to move close to and away from each other. The flexible push generator is disposed near the first carrier or the second carrier and generates a flexible push to the carried objective substrate or transfer substrate when the first carrier and the second carrier are actuated in a way close to each other. A method of bonding an electronic component and a method for manufacturing a light-emitting diode display are also provided.Type: ApplicationFiled: April 20, 2023Publication date: December 14, 2023Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Chingju Lin, Jia Wei Huang
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Publication number: 20230142207Abstract: An apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate is provided. The apparatus includes a first frame, a second frame, an abutment element and a deformation generating mechanism. The first frame is used to carry the flexible carrier substrate. The second frame is used to carry the flexible target substrate. The abutment element is arranged adjacent to the first frame, and is controlled by a braking mechanism, and move repeatedly toward and away from the second frame. The deformation generating mechanism is adjacent to the second frame and arranged opposite to the abutment element. When the abutment element moves toward the second frame, the deformation generating mechanism forms a relative force toward the abutment element at a position where the surface of the flexible target substrate carried by the second frame is relative to the abutment element.Type: ApplicationFiled: August 10, 2022Publication date: May 11, 2023Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Chingju Lin, Yi Xian Wu
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Publication number: 20230030227Abstract: An apparatus for transferring an electronic component is configured to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutment module, an actuator, and a negative pressure generating device. The abutment module includes an abutting component and a guide. The guide guides a movement of the abutting component. The actuator actuates the abutment module so that the abutting component and the guide are respectively moved between a start position and an end position of an abutment path. The negative pressure generating device is pumped through the abutment module. When the abutment module abuts against the flexible carrier, a negative pressure is generated between the abutment module and the flexible carrier by the negative pressure generating device. The abutting component and the guide are moved simultaneously in at least a portion of the abutment path.Type: ApplicationFiled: May 16, 2022Publication date: February 2, 2023Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Kuo-Pin Chuan, Sheng-Che Huang, Shu-Hsien Huang
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Publication number: 20220359455Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.Type: ApplicationFiled: January 18, 2022Publication date: November 10, 2022Applicant: Stroke Precision Advanced Engineering Co., Ltd.Inventors: Yu-Min Huang, Sheng Che Huang, Chingju Lin, Wei-Hao Wang