Patents Assigned to Stryke Industries, LLC
  • THERMALLY ENHANCED PRINTED CIRCUIT BOARD ARCHITECTURE FOR HIGH POWER ELECTRONICS
    Publication number: 20190116657
    Abstract: A thermally enhanced printed circuit board architecture includes one or more electrically insulating composite layers, one or more electrically conductive layers, and one or more thermally conductive layers assembled into a stack.
    Type: Application
    Filed: October 17, 2018
    Publication date: April 18, 2019
    Applicant: Stryke Industries, LLC
    Inventors: Ian Fuller, Van Flamion
  • THERMAL PROTECTION SYSTEM UTILIZING INSULATING AND CONDUCTIVE MATERIALS
    Publication number: 20190011074
    Abstract: A thermal protection system includes an outer coating layer, at least one inner bond coat layer, and a conductive layer positioned adjacent at least one of the outer coating layer and the at least one bond coat layer.
    Type: Application
    Filed: May 30, 2018
    Publication date: January 10, 2019
    Applicant: Stryke Industries, LLC
    Inventors: Ian Fuller, Van Flamion