Abstract: A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.

Abstract: A step-type stacked chip packaging structure based on a resin spacer that includes: a plastic packaging material, a circuit board, a resin spacer, a first chip, a second chip and an electrical connection assembly. The resin spacer, the first chip, and the second chip are stacked on the circuit board respectively. The second chip is stacked on the first chip in a stepped manner. The circuit board, the first chip and the second chip are electrically connected together through the electrical connection assembly. The resin spacer uses a fiber glass fabric as its base material, a weight percent of the fiber glass fabric is 10-60 wt %, and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent.

Abstract: A step-type stacked chip packaging structure based on a resin spacer that includes: a plastic packaging material, a circuit board, a resin spacer, a first chip, a second chip and an electrical connection assembly. The resin spacer, the first chip, and the second chip are stacked on the circuit board respectively. The second chip is stacked on the first chip in a stepped manner. The circuit board, the first chip and the second chip are electrically connected together through the electrical connection assembly. The resin spacer uses a fiber glass fabric as its base material, a weight percent of the fiber glass fabric is 10-60 wt %, and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent.

Abstract: A resin spacer for chip stacking and packaging includes a fiber glass fabric used as a base material, a weight percent of the fiber glass fabric is 10-60 wt %; and the following components are attached to the fiber glass fabric as a percentage by the total weight of the resin spacer: 8-40 wt % of epoxy resin, 10-30 wt % of quartz powder, 2-10 wt % of aluminum oxide, 1-8 wt % of calcium oxide, and 1-8 wt % of curing agent. The resin spacer further includes a pigment. The pigment has a weight percent of 1-3 wt %, and the pigment is preferably at least one selected from white carbon black and pearl powder. The resin spacer is formed by mixing, impregnating, partially curing, stacking and pressing the resin material. The thickness of the resin spacer is 0.07-0.13 mm.