Patents Assigned to Substrate Technologies, Inc.
  • Patent number: 6248612
    Abstract: An enhanced ball grid array substrate package and method for manufacturing the same, where the substrate package includes a metal core having a first surface and a second surface opposite the first surface. The metal core further includes at least one cavity in which at least one integrated circuit is positioned. A dielectric layer is secured to the first surface of the metal core and includes at least one die cavity formed therein. Thereafter, a conductive seed layer is chemically deposited to exposed portions of the dielectric layer and the first surface of the metal core. Adjacent to the conductive seed layer, a circuit is electrolytically and selectively formed within a first circuit pattern.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: June 19, 2001
    Assignee: Substrate Technologies, Inc.
    Inventors: Abram M. Castro, Aaron R. Castro