Patents Assigned to Suisaku Limited
  • Patent number: 6287505
    Abstract: Self-tuning materials which can efficiently emit or receive radio waves in spite of being simple in their construction and small in their dimension, and are applied to patch antenna, wave directors or the like. Metallic chips containing two or more kinds of ingredients which are distributed in a layered, net-like or needle-shaped configuration, and an organic or inorganic bonding material which is small in dissipation of electric power under radio waves of high frequencies are mixed with each other, and are pressurized under a high pressure while being highly electrified in the direction perpendicular to the pressurizing direction to mold the metallic chips and the bonding material in a plate-shaped configuration while being heated.
    Type: Grant
    Filed: July 6, 1999
    Date of Patent: September 11, 2001
    Assignee: Suisaku Limited
    Inventor: Etsuko Kaitani
  • Patent number: 6031509
    Abstract: Self-tuning materials which can efficiently emit or receive radio waves in spite of being simple in their construction and small in their dimension, and are applied to patch antenna, wave directors or the like. Metallic chips containing two or more kinds of ingredients which are distributed in a layered, net-like or needle-shaped configuration, and an organic or inorganic bonding material which is small in dissipation of electric power under radio waves of high frequencies are mixed with each other, and are pressurized under a high pressure while being highly electrified in the direction perpendicular to the pressurizing direction to mold the metallic chips and the bonding material in a plate-shaped configuration while being heated.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: February 29, 2000
    Assignee: Suisaku Limited
    Inventor: Etsuko Kaitani