Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
Type:
Application
Filed:
March 18, 2014
Publication date:
August 14, 2014
Applicants:
Kunio Mori, Sulfur Chemical Institute Incorporated, MEIKO ELECTRONICS CO., LTD.
Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
Type:
Application
Filed:
September 30, 2011
Publication date:
July 18, 2013
Applicants:
Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute Incorporated
Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
Type:
Application
Filed:
September 28, 2011
Publication date:
July 11, 2013
Applicants:
Sulfur Chemical Institute Incorporated, Kunio Mori